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Latest Publications & Patents on Electronics

Electronics

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This is our latest selection of worldwide publications and patents in english on Electronics, between many scientific online journals, classified and focused on electronics, resistor, capacitor, diode, transistor, PCB and microcontroller.

Material-specific lighting requirements and contemporary illumination strategies for galleries

Published on 2026-07-08 by @OXFORD

Abstract: AbstractMuseum lighting simultaneously governs visual presentation and light-induced degradation of artworks. With the widespread adoption of light emitting diode technologies, traditional illuminance- and dose-based standards are increasingly insufficient to address the heterogeneous photochemical responses of different materials. This review synthesizes recent research on material-specific lighting requirements and contemporary illumination strategies for galleries, focusing on spectral power [...]


Our summary: This review addresses material-specific lighting needs and modern strategies for gallery illumination. It highlights the varying sensitivity of artworks to different light wavelengths and the impact on visual presentation and degradation. Optimized lighting approaches can significantly enhance energy efficiency while preserving artwork integrity.

museum lighting, photochemical responses, illumination strategies, energy optimization

Publication

Semiconductor structure and method of forming the same

Patent published on the 2026-07-02 in US under Ref US20260190379 by TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD [TW] (Chen Fei-yun [tw], Hsu Ching-hsiung [tw], Hung Chan-yu [tw], Lin Kau-chu [tw])

Abstract: A semiconductor structure and a method of forming the semiconductor structure are provided. The method includes: receiving a semiconductor substrate; forming a first well region and a second well region within the semiconductor substrate; forming a first dielectric layer on the semiconductor substrate between the first well region and the second well region; forming an interconnect structure comprising a second dielectric layer over the semiconductor substrate; and depositing a conductive layer [...]


Our summary: A semiconductor structure is formed by creating well regions and dielectric layers on a substrate. An interconnect structure is established with a conductive layer serving as a gate electrode. This process enables the formation of transistors within designated zones of the semiconductor substrate.

semiconductor structure, dielectric layer, conductive layer, transistor

Patent

Display panel and electronic device including the same

Patent published on the 2026-07-02 in US under Ref US20260190579 by SAMSUNG DISPLAY CO LTD [KR] (Seo Youngseok [kr], Kim Kyungho [kr], Lee Younjoo [kr])

Abstract: An embodiment of the present disclosure provides a display panel including a plurality of first areas and a second area around each of the plurality of first areas. The display panel includes: a pixel circuit layer including a plurality of pixel circuits and insulating layers and provided in each of the plurality of first areas; a plurality of light-emitting diodes on the pixel circuit layer and electrically connected to each of the plurality of pixel circuits; a connection line provided in the [...]


Our summary: The disclosure describes a display panel with multiple first areas and a second area surrounding them. It features a pixel circuit layer with pixel circuits and insulating layers. Additionally, it includes light-emitting diodes and connection lines that link adjacent pixel circuits.

Display panel, electronic device, pixel circuit, light-emitting diodes

Patent

Chip and preparation method therefor, package substrate and preparation method therefor, chip package structure, terminal device, and communication sy

Patent published on the 2026-07-02 in WO under Ref WO2026139027 by HUAWEI TECH CO LTD [CN] (Xiao Fang [cn], Liu Dong [cn], Wang Qi [cn], Wang Qiheng [cn])

Abstract: Embodiments of the present application relate to the technical field of electronics, and provide a chip and a preparation method therefor, a package substrate and a preparation method therefor, a chip package structure, a terminal device, and a communication system, for use in improving signal transmission performance in the chip package structure. The chip comprises a first dielectric layer, a first capacitor plate, and a second capacitor plate, wherein the second capacitor plate, the first cap[...]


Our summary: The application provides a chip and its preparation method, along with a package substrate and its preparation method. It features a chip package structure designed to enhance signal transmission performance. The implementation of a coupling capacitor mitigates unequal return ground voltages, improving co-packaged chip performance.

chip, package substrate, signal transmission, communication system

Patent

Semiconductor device

Patent published on the 2026-07-02 in WO under Ref WO2026140427 by MINEBEA POWER SEMICONDUCTOR DEVICE INC [JP] (Namai Masaki [jp])

Abstract: The present invention reduces recovery loss in an RC-IGBT by suppressing the injection of holes in a diode region in the vicinity of a boundary between an IGBT region and the diode region. The present invention pertains to a semiconductor device 100 comprising an RC-IGBT, wherein: in an IGBT of an IGBT region 21, an emitter electrode 14A and a body layer 2 are ohmic-connected with a contact layer 8 interposed therebetween; a diode region 22 has a low-injection diode region 22B in which an anode [...]


Our summary: The invention reduces recovery loss in an RC-IGBT by suppressing hole injection in the diode region. It includes an IGBT region with ohmic connections and a diode region with both low and high-injection areas. The design separates the low-injection diode region from the IGBT region to enhance performance.

RC-IGBT, semiconductor device, diode region, recovery loss

Patent

Power module assembly

Patent published on the 2026-07-02 in WO under Ref WO2026142408 by HYOSUNG CORP [KR] (Kim Sung Joo [kr], Jung Byung Hwan [kr], Kim Su Hyeon [kr])

Abstract: The present invention relates to a power module assembly. According to the present invention, a plurality of capacitors are mounted on a frame, and heat generated from the capacitors is discharged to the outside through a heat dissipation plate installed on one surface of the frame. The frame on which the capacitors are mounted may be fixed to the outside or the enclosure by first, second, and third fixing brackets (17, 18, 19). In addition, a first bus bar and the frame are firmly coupled by us[...]


Our summary: The invention describes a power module assembly with capacitors mounted on a frame. Heat generated by the capacitors is dissipated through a heat dissipation plate. The assembly is secured against external vibrations using fixing brackets and supports.

power module, capacitors, heat dissipation, vibration resistance

Patent

Display panel and electronic device including the same

Patent published on the 2026-07-02 in US under Ref US20260190578 by SAMSUNG DISPLAY CO LTD [KR] (Jo Mankyu [kr], Park Jonghwa [kr], Kim Kyungho [kr])

Abstract: [0000] A display panel includes: a base layer including a display area, and a non-display area surrounding around the display area; a first pixel circuit layer in the display area, and including a transistor and insulating layers; a second pixel circuit layer in the display area, and including a transistor and insulating layers; a first light-emitting diode on the first pixel circuit layer, and electrically connected to the transistor of the first pixel circuit layer; a second light-emitting dio[...]


Our summary: The display panel consists of a base layer with a display area and a non-display area. It features two pixel circuit layers, each containing transistors and insulating layers. The design includes light-emitting diodes connected to the transistors and a connection line with improved resistance characteristics.

Display panel, electronic device, pixel circuit, light-emitting diode

Patent

insights derived from the photorefractive responses and transient dynamics of photocurrents

Published on 2026-06-17 by Naoto Tsutsumi, Takafumi Sassa, Kento Masumura, Tsuyoshi Oka, Sho Tsujimura, Boaz Jessie Jackin, Kenji Kinashi @NATURE

Abstract: Polymer Journal, Published online: 17 June 2026; doi:10.1038/s41428-026-01219-9Second electron trap, Alq3, significantly suppresses photocurrent by which the benefit for applying higher field is gained and resultant faster diffraction time in the order of hundreds microseconds is achieved for photorefractive (PR) polymer of PTAA with PCBM and Alq3. The transient dynamics of photocurrent gave the time trace of the photocarrier generation proceeses, which can be straightly related to that of diffr[...]


Our summary: The study examines the effects of Alq3 on the photorefractive performance of PTAA with PCBM. It reveals that Alq3 suppresses photocurrent, enabling faster diffraction times. Insights into photocarrier generation processes are linked to diffraction efficiency through transient dynamics analysis.

photorefractive, photocurrent, transient dynamics, Alq3

Publication

Topics covered: Ternary Heterojunction, Synaptic Transistors, Perovskite Quantum Dots, Neuromorphic Computing, Harmony Search Algorithm, Volt-Var Optimization, Metaheuristic-Based Optimization, PV-Based Microgrid, Metal-Capping Layer, Oxygen Scavenger Effect, High-Mobility P-Type Semiconductors, Tellurium, Tunable Diode Effect, Superconducting Tunnel Junction, Biharmonic Drive, Josephson Diode, Piezoelectric Nanogenerator, and P(VDF-TrFE) Nanocomposite..

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(if date is unknown or not relevant, e.g. "fluid mechanics", a rounded estimation of its notable emergence is provided)

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