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Dernières publications et brevets sur l'électronique

Électronique

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Voici notre dernière sélection de publications et brevets mondiaux en anglais sur l'électronique, parmi de nombreuses revues scientifiques en ligne, classées et axées sur l'électronique, la résistance, le condensateur, la diode, le transistor, le circuit imprimé et le microcontrôleur.

Film, laminate, roll, film capacitor, and film production method

Patent published on the 2026-10-15 in WO under Ref WO2026216600 by KURARAY CO LTD [JP] (Matsuo Kazuhiro [jp], Oomoto Hideki [jp])

Abstract: A film having an arithmetic average roughness (Ra) on both surfaces of 0.010-0.500 μm, and comprising a copolymer that contains a constitutional unit (a) derived from a compound represented by formula (I). (In formula (I), X is at least one selected from the group consisting of cyano groups, -COOR1, and halogen atoms, and R1 is a C1-10 alkyl group.)[...]


Our summary: A film with an arithmetic average roughness of 0.010-0.500 μm is described. It comprises a copolymer containing a specific constitutional unit derived from a defined compound. The compound includes cyano groups, -COOR1, and halogen atoms, with R1 being a C1-10 alkyl group.

film capacitor, copolymer, arithmetic average roughness, film production method

Patent

Systems and methods for power distribution in appliances

Patent published on the 2026-10-15 in WO under Ref WO2026217368 by CHU AN AN [US] (Privitera Peter [us], Lenius Samuel William [us], D'amico Samuel Redmond [us], Webb Jim [us], Tallon Bradley James [us], Hoover Christopher [us], ThÉou Jean-baptiste [us], Chu An An [us])

Abstract: An apparatus includes a first housing and a second housing configured to be mechanically coupled to the first housing. The apparatus includes an inverter PCB that has a network interface. The apparatus includes a battery pack at least partially disposed within the first housing and separately certified from remaining portions of the apparatus. The apparatus includes a bidirectional inverter at least partially disposed within the second housing and separately certified from remaining portions of [...]


Our summary: The apparatus features a first and second housing for power distribution in appliances. It includes an inverter PCB, a battery pack, and a bidirectional inverter, all certified separately. A DC bus and a communication bus facilitate operation and connectivity between the components and appliances.

power distribution, inverter PCB, battery pack, communication bus

Patent

Microfluidic devices containing micro-immunobeads-based electromagnetic operation systems and methods of use thereof

Patent published on the 2026-10-15 in US under Ref US20260316074 by ADVANCED BIOMEDICAL INSTRUMENTATION CENTRE LTD [CN] (Fan Xiaoxue [cn], Ye Xinyu [cn], Chang Chuen Chung [cn], Shum Ho Cheung [cn], Lin Haisong [cn])

Abstract: Microfluidic devices and methods for automated analyte detection are provided. The microfluidic devices contain a biochip and an electromagnetic (EM) chip with a programmable navigation matrix. The biochip includes a sample loading chamber, one or more wash chambers, a binding chamber, a detection chamber, and optionally a stop buffer chamber, all of which may be in fluid communication with each other. Immunomagnetic exosome beads can be pre-loaded or added separately to capture target analytes.[...]


Our summary: The microfluidic device integrates a biochip and an electromagnetic chip for analyte detection. It features chambers for sample processing and uses immunomagnetic beads for target capture. The electromagnetic chip manipulates the beads through programmable coils and circuits.

Microfluidics, Immunobeads, Electromagnetic manipulation, Automated analyte detection

Patent

Determining three-dimensional electromagnetic coupling of high voltage switching circuits and systems

Patent published on the 2026-10-15 in US under Ref US20260323839 by RAYTHEON CO [US] (Tran Thanh Thien [us], Brech Dale E [us], Walker Debbie A [us], Gugler Douglas P [us])

Abstract: [0000] A computer system performs a computer-implemented method of fabricating a multi-layer PCB. The computer system includes an electronic computer processor configured to execute program instructions to control the computer system to perform operations including generating a PCB stackup of a PCB to be fabricated, and identifying at least one target area included in the PCB stack. The at least one target area includes a first layer overlapping a second layer. The method further includes genera[...]


Our summary: The method involves generating a PCB stackup and identifying target areas within it. A 3D electromagnetic model is created to analyze coupling voltages from interference. The S-parameter circuit is modified to achieve desired voltage characteristics in the fabricated PCB.

electromagnetic coupling, multi-layer PCB, S-parameter circuit, fabrication method

Patent

Semiconductor device and methods of formation

Patent published on the 2026-10-15 in US under Ref US20260324402 by TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD [TW] (Chang Wei-jen [tw], Jiang Jheng-yi [tw], Hsu Ruei-jyun [tw], Ho Chia-chi [tw], Chiang Chung-shih [tw])

Abstract: [0000] A semiconductor transistor device includes gate electrodes on a first side (e.g., frontside) of the device and source/drain electrodes disposed in recesses formed from a second side (e.g., backside) of the device. The recesses are formed from the backside of the device through a substrate and into a gallium-based layer. The recesses are filled with conductive (e.g., metal) material to form the source/drain electrodes. The source/drain electrodes may be formed in part of the gallium-based [...]


Our summary: A semiconductor transistor device features gate electrodes on the frontside and source/drain electrodes in recesses from the backside. The recesses are filled with conductive material and may connect to a backside ground plate for heat dissipation. This configuration allows for reduced width, enhancing electron mobility and lowering serial resistance.

semiconductor, transistor, source/drain electrodes, gallium-based layer

Patent

Light-emitting diode displays with low latency and related methods

Patent published on the 2026-10-15 in US under Ref US20260323801 by CREELED INC [US] (Hussell Christopher P [us])

Abstract: [0000] Light-emitting diode (LED) packages and, more particularly, LED displays with low latency and related methods are disclosed. LED displays and related methods include reverse-pixel addressing that involves arranging data stream segments in reverse order so that an LED package that is farthest away in a serial string receives its data segment precedently or concurrently with that of an LED package positioned at the beginning of the serial string. LED packages form LED pixels of an array whe[...]


Our summary: LED displays utilize low latency techniques through reverse-pixel addressing. This method allows data segments to be arranged in reverse order for efficient data loading. The result is that all LED pixels receive their data simultaneously, enabling quick frame advancement.

LED displays, low latency, reverse-pixel addressing, data stream segments

Patent

Shell lattice structure design with directional fluid channels for efficient heat dissipation

Published on 2026-09-28 by @OXFORD

Abstract: AbstractThe growing demand for heat dissipation in aerospace, electronics cooling, and advanced energy systems is becoming increasingly critical, where maintaining lightweight design is equally vital for their high efficiency. To satisfy both requirements, lattice structures have emerged as promising candidates due to their high surface-area-to-volume ratio and lightweight nature. This study introduces a novel lightweight shell lattice structure with enhanced heat dissipation performance. The sk[...]


Our summary: This study presents a lightweight shell lattice structure designed for improved heat dissipation. It utilizes a skeleton-driven parametric modeling approach to optimize fluid channels within the lattice. Simulations and experiments confirm its effectiveness in reducing temperatures and pressure drops compared to traditional designs.

lattice structures, heat dissipation, fluid channels, topology optimization

Publication

Computational active materials and embodied intelligence in extreme conditions

Published on 2026-09-22 by Yifan Yang, Fan Xu @NATURE

Abstract: Nature Computational Science, Published online: 22 September 2026; doi:10.1038/s43588-026-01051-4Embodied intelligence has enabled machines to act autonomously, yet intelligence remains largely confined to digital models, leaving robotic bodies as passive executors. In extreme environments, such as the human brain, where tissues are mechanically and thermally sensitive, conventional electronics can become limiting. Here, we discuss how active materials, which embed intelligence directly within t[...]


Our summary: Active materials can embed intelligence directly within their structure, enhancing robotic capabilities in extreme conditions. Conventional electronics face limitations in mechanically and thermally sensitive environments. This study emphasizes the importance of computation-aided design in advancing these technologies.

active materials, embodied intelligence, robotics, extreme environments

Publication

Sujets abordés : Hétérojonction ternaire, transistors synaptiques, points quantiques pérovskites, informatique neuromorphique, algorithme de recherche harmonique, optimisation volt-variable, optimisation basée sur des métaheuristiques, micro-réseau basé sur le photovoltaïque, couche de recouvrement métallique, Effet piégeur d'oxygène, semi-conducteurs de type P à haute mobilité, tellure, effet de diode accordable, jonction tunnel supraconductrice, entraînement biharmonique, diode Josephson, nanogénérateur piézoélectrique et nanocomposite P(VDF-TrFE)..

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