Product Design, Manufacturing & Innovation Resources

Latest Publications & Patents on MEMS

MEMS

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This is our latest selection of worldwide publications and patents in english on MEMS, between many scientific online journals, classified and focused on MEMS.

Vertical mems probe having tethering structure and manufacturing method thereof

Patent published on the 2026-07-02 in US under Ref US20260186021 by WITHMEMS CO LTD [KR] (Lee Sanghyeop [kr], Koo Hwang-sub [kr], Bang Ho Sub [kr], Cha Jaewoo [kr], Yoo Seok Hwan [kr], Bu Jong-uk [kr])

Abstract: Proposed are a vertical MEMS probe having a tethering structure and a manufacturing method thereof. The probe includes a pin including a contact portion that contacts at least one of two ends thereof and an elastic portion that withstands a contact load applied to the contact portion by an elastic restoring force between the two ends, a housing having a penetration portion that exposes the contact portion to an outside, and configured to cover the elastic portion, and a tether configured to conn[...]


Our summary: The document describes a vertical MEMS probe featuring a tethering structure and its manufacturing method. The probe includes a pin with a contact portion and an elastic portion to withstand contact loads. A housing covers the elastic portion while exposing the contact portion, and a tether connects different components of the probe.

MEMS, probe, tethering structure, manufacturing method

Patent

Method for manufacturing a micro-electrical-mechanical-system with a beam structure

Patent published on the 2026-07-01 in EP under Ref EP4768427 by FYZIKALNI USTAV AV CR V V I [CZ] (Szabo Ondrej [cz], Kromka Alexander [cz], Potocky Stepan [cz], Vanko Gabriel [cz])

Abstract: [0001] The present invention relates to a method for manufacturing a micro-electrical-mechanical system (MEMS) with a beam structure, comprising the following steps: providing a substrate; depositing a sacrificial layer of silicon dioxide or silicon nitride on the substrate; cutting or etching a part in the sacrificial layer to support the beam structure using laser-assisted machining, wet etching or dry etching, whereby the sacrificial layer is removed down to the substrate; depositing a diamon[...]


Our summary: The invention outlines a method for manufacturing a MEMS with a beam structure. It involves using a substrate, depositing a sacrificial layer, and employing laser-assisted machining for precision. The process ensures high quality and durability of the MEMS components.

MEMS, beam structure, laser machining, sacrificial layer

Patent

Arrangement for combined resonance and quasistatic scanning modes of mems mirrors

Patent published on the 2026-06-24 in EP under Ref EP4764649 by MURATA MANUFACTURING CO [JP] (Torkkeli Altti [fi])

Abstract: The disclosure describes an arrangement comprising a spring-supported tiltable hermetic housing structure with an optical window and single-axis scanning mirror inside the housing structure. The arrangement enables the use of the resonance scanning mode of the mirror in vacuum, inside the housing structure, as well as the quasistatic scanning mode of the mirror by oscillating the housing structure in ambient pressure.[...]


Our summary: The arrangement features a spring-supported tiltable hermetic housing with an optical window and a single-axis scanning mirror. It allows resonance scanning in vacuum and quasistatic scanning by oscillating the housing in ambient pressure. This design enhances the functionality of MEMS mirrors in various environments.

MEMS mirrors, resonance scanning, quasistatic scanning, hermetic housing

Patent

Shrink fitted electronic device

Patent published on the 2026-06-24 in EP under Ref EP4765201 by SIEMENS AG [DE] (Grundmann JÖrn [de], Walbrecker-baar Christian [de], Madkour Sherif [de], Kriegel Kai [de], Schwarz Florian [de], Mitic Gerhard [de], Stegmeier Stefan [de])

Abstract: The invention relates to assembly and disassembly of electronic devices, e.g. power modules or MEMS modules. In that context, the invention is situated at the intersection of advanced assembly of electronic devices and environmental sustainability. It addresses the critical need for Robust Eco-Design (RED) with design in the 7R setting. For that purpose, the invention foresees to equip components of the electronic device which are to be fixed to each other, e.g. a heat sink, a substrate, and a s[...]


Our summary: The invention focuses on the assembly and disassembly of electronic devices using a shrink fitting procedure. It emphasizes robust eco-design principles within the 7R framework. The approach enables secure fixation and easy separation of components like heat sinks and semiconductor chips.

Shrink fitting, electronic devices, eco-design, assembly techniques

Patent

Stacked die with stepped surface

Patent published on the 2026-06-18 in US under Ref US20260167483 by INVENSENSE INC [US] (Arimatsu Daishi [jp], Akiyama Jotaro [jp], Shibano Yuki [jp])

Abstract: [0000] A device includes a semiconductor layer, a micro-electro-mechanical systems (MEMS) device stacked on the semiconductor layer, and a package substrate. A step-shaped portion is formed on at least one exterior side of the MEMS device. The step-shaped portion includes a conductive layer formed thereon. The package substrate includes a wirebond pad, wherein a first wire electrically connects the semiconductor layer to the wirebond pad of the package substrate. A second wire electrically conne[...]


Our summary: The device features a semiconductor layer with a stacked MEMS device. A step-shaped portion on the MEMS device includes a conductive layer. Two wires connect the semiconductor layer and the conductive layer to the package substrate.

semiconductor, MEMS, wirebond, package substrate

Patent

Method for compensating mechanical and electrical nonlinearities of oscillators based on mems devices and mems system thereof

Patent published on the 2026-06-18 in US under Ref US20260171967 by POLITECNICO DI MILANO [IT] (Padovani Christian [it], Gattere Gabriele [it], Langfelder Giacomo [it])

Abstract: [0000] A microelectromechanical oscillator includes: a device including a movable structure and oscillating at a working frequency; a sustaining circuit configured to sustain oscillations of the device; a compensation terminal capacitively coupled to the movable structure and configured to apply a compensation signal to the movable structure; and a modulation terminal cooperating with the sustaining circuit to control an amplitude of the oscillations. An electronic processing circuit is configur[...]


Our summary: A microelectromechanical oscillator includes a movable structure and a sustaining circuit. It utilizes a compensation terminal to apply a compensation signal for correcting nonlinearities. An electronic processing circuit generates and demodulates signals to produce the necessary compensation.

MEMS, oscillator, compensation, nonlinearities

Patent

Real-Time Axle-Load Sensing and AI-Enhanced Braking-Distance Prediction for Multi-Axle Heavy-Duty Trucks

Published on 2026-02-03 by Duk Sun Yun, Byung Chul Lim @MDPI

Abstract: Accurate braking-distance prediction for heavy-duty multi-axle trucks remains challenging due to the large gross vehicle weight, tandem-axle interactions, and strong transient load transfer during emergency braking. Recent studies on tire&amp;ndash;road friction estimation, commercial-vehicle braking control (EBS/AEBS), and weigh-in-motion (WIM) sensing have highlighted that unmeasured vertical-load dynamics and time-varying friction are key sources of prediction uncertainty. To address thes[...]


Our summary: This study presents a framework for real-time axle-load sensing and AI-enhanced braking-distance prediction for heavy-duty trucks. It integrates dynamic load estimation with friction sensing and machine learning to improve prediction accuracy. The results show significant enhancements in braking-distance predictions compared to traditional methods, supporting advanced driver-assistance and safety management systems.

Axle-Load Sensing, Braking-Distance Prediction, Machine Learning, Heavy-Duty Trucks

Publication

Investigation of III-Nitride MEMS Pressure Sensor for High-Temperature Applications

Published on 2026-01-28 by Makhluk Hossain Prio, Maruf Morshed, Lavanya Muthusamy, Md Sohanur E. Hijrat Raju, Itmenon Towfeeq, Durga Gajula, Goutam Koley @MDPI

Abstract: High-temperature operation of AlGaN/GaN Heterojunction Field Effect Transistor embedded diaphragm-based MEMS pressure sensors have been investigated, which utilized their wide bandgap and piezo resistivity to perform stably at elevated temperatures. The performance of the pressure sensor was observed over a change in applied pressure of 35 kPa, which resulted in an experimentally measured change in drain&amp;ndash;source resistance (&amp;Delta;RDS/RDS(0)) of 0.32% at room temperature and[...]


Our summary: The study investigates a MEMS pressure sensor using AlGaN/GaN transistors for high-temperature applications. The sensor shows stable performance at temperatures up to 300 °C with a change in resistance of 0.65% at 250 °C. Finite Element simulations corroborate experimental results, indicating strong potential for reliable pressure sensing in harsh environments.

MEMS, III-Nitride, High-Temperature, Pressure Sensor

Publication

Topics covered: diagnosing, digital MEMS microphone, abnormality, apparatus, Finite Element Analysis, Soft-Pad Moldless Stamping, Bistable Circular Micro Shells, Microfabrication, Cavity-SOI, micromachining, resonant pressure sensors, MEMS Pirani vacuum gauge, porous silicon, synchronization, large-aperture, electromagnetic, tensile testing, ASTM F2630, ISO 16063, IEC 62047, ISO/IEC 27001, and ISO 9001..

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