Bei der Flüssigmetallversprödung (Liquid Metal Embrittlement, LME) handelt es sich um ein Phänomen, bei dem bestimmte duktile Metalle spröde werden, wenn sie bestimmten Flüssigmetallen ausgesetzt werden, was zu einem plötzlichen und katastrophalen Versagen unter Belastung führt. Dies geschieht durch das schnelle Eindringen des flüssigen Metalls entlang der Korngrenzen des festen Metalls, wodurch die interatomaren Bindungen geschwächt und die Rissentstehung und -ausbreitung erleichtert werden. LME hängt in hohem Maße von der Kombination der beteiligten festen und flüssigen Metalle sowie von Faktoren wie Temperatur und angewandter Spannung ab. Gängige Beispiele aus der Industrie sind die Versprödung von Stahl durch flüssiges Zink oder Aluminium bei Feuerverzinkungsprozessen.
Dies ist unsere neueste Auswahl weltweiter Veröffentlichungen und Patente in englischer Sprache zum Thema Flüssigmetallversprödung (Liquid Metal Embrittlement, LME), klassifiziert und konzentriert auf Flüssigmetallversprödung, Metallversprödung, Flüssigmetall, Ga-Al, Flüssigmetall-induzierte Versprödung, induzierte Versprödung, Duktilitätsverlust, duktil-zu-spröde, Korngrenzen, Quecksilberversprödung, Galliumversprödung, Al-Ga, Flüssiggallium und Aluminiumgallium.
Microstructure Evolution During Preparation of Semi-Solid Billet for 7075 Aluminum Alloy by EASSIT Process
Published on 2025-04-17 by Yanghu Hu, Ming Chang, Shuqin Fan, Boyang Liu, Yongfei Wang, Shuangjiang Li, Chao Zhang, Peng Zhang, Shengdun Zhao @MDPI
Abstract: The 7075 aluminum alloy semi-solid billet is prepared using the extrusion alloy semi-solid isothermal treatment (EASSIT) process. These findings indicate that as the isothermal time increases, there is a noticeable increase in both the average grain size (AGS) and shape factor (SF). The relationship between the AGS, SF, and isothermal temperature is complex due to the influence of grain refinement mechanisms. The HV0.2 of isothermal samples decreased with the increase in isothermal temperature, [...]
Our summary: The study investigates the microstructure evolution of 7075 aluminum alloy semi-solid billet prepared by the EASSIT process. Increasing isothermal time leads to larger average grain size and shape factor. Cu and Si segregation affects the coarsening behavior at high temperatures.
Microstructure Evolution, Semi-Solid Billet, EASSIT Process, Grain Refinement
Process method for producing x80 pipeline steel having extreme specifications in high water temperature seasons
Patent published on the 2025-04-03 in WO under Ref WO2025066736 by BENGANG STEEL PLATES CO LTD [CN] (Wu Gang [cn], Liu Zhipu [cn], Han Yu [cn], Gong Zhen [cn], Zhou Yanfeng [cn], Ma Siyuan [cn])
Abstract: A process method for producing X80 pipeline steel having extreme specifications in high water temperature seasons. Ideal mechanical properties and microstructure are obtained by means of controlling composition, heating, rolling, cooling, laminar cooling water temperature and other processes and technologies. The metallographic structure of the steel is composed of acicular ferrite + granular bainite + M-A; in particular, the content of the M-A component is controlled to be 4-8%, and the average[...]
Our summary: Ideal process method for producing X80 pipeline steel with extreme specifications in high water temperature seasons, achieving ideal mechanical properties and microstructure, meeting standard requirements for pipeline projects prone to large plastic deformation.
pipeline steel, process method, high water temperature, mechanical properties
Patent
Conductive and adhesive liquid metal copper paste
Patent published on the 2025-03-06 in WO under Ref WO2025049954 by VIRGINIA TECH INTELLECTUAL PROPERTIES INC [US] (Bartlett Michael D [us], Anand Tutika Ravi Tej [us])
Abstract: Embodiments of a liquid metal paste for coupling conductive components of circuits formed in or on rigid, flexible, and stretchable substrates are described. In one example, a liquid metal paste includes liquid metal. The liquid metal paste further includes copper elements mixed with the liquid metal to form a conductive mixture. In another example, the liquid metal paste further includes an elastomer material mixed with the liquid metal to form a conductive and adhesive mixture.[...]
Our summary: Liquid metal copper paste for coupling conductive components in circuits on various substrates, includes copper elements and elastomer material for conductivity and adhesion.
liquid metal, copper paste, conductive components, elastomer material
Patent
Assembly of flexible interconnects using sedimentation
Patent published on the 2025-03-06 in WO under Ref WO2025048947 by VIRGINIA TECH INTELLECTUAL PROPERTIES INC [US] (Bartlett Michael D [us], Ho Dong Hae [us])
Abstract: Embodiments of interplanar interconnects, intraplanar interconnects, and methods for forming the same in rigid, flexible, and stretchable substrates are described. In one example, a method for forming interplanar interconnects in a substrate includes injecting a solution into a mold cavity of a molding structure. The solution includes a polymer matrix and liquid metal elements. The method further includes performing a curing process on the solution to form an interplanar interconnect in the poly[...]
Our summary: Assembly of flexible interconnects using sedimentation, methods for forming interplanar and intraplanar interconnects in rigid, flexible, and stretchable substrates, injecting solution with polymer matrix and liquid metal elements into mold cavity for interplanar interconnect formation.
interconnects, sedimentation, flexible, substrates
Patent
