Questa è la nostra ultima selezione di prodotti in tutto il mondo pubblicazioni e brevetti in inglese sui MEMS, tra le numerose riviste scientifiche online, classificate e focalizzate sui MEMS.
A Comparative Study
Published on 2025-03-10 by Rana Abdelrahman, Alaaeldin Elhady, Yasser S. Shama, Mohamed Abdelrahman, Alexis Jollivet, Dogu Ozyigit, Mustafa Yavuz, Eihab M. Abdel-Rahman @MDPI
Abstract: Electrostatic actuation is widely employed in microelectromechanical systems (MEMS) due to its distinct advantages. However, it requires high voltage, typically provided by a power supply and a high voltage amplifier, which is limited in gain, especially at high frequencies. Various methods have been proposed to amplify the voltage signal fed into the system by coupling it in series to an LC tank circuit. In this work, we analyze and compare three methods, resonance matching, multi-frequency exc[...]
Our summary: A Comparative Study. Analyzing and comparing three methods of voltage signal amplification in high-frequency MEMS actuation: resonance matching, multi-frequency excitation, and amplitude modulation. Resonant circuits offer a more effective solution than a voltage amplifier.
Electrostatic actuation, MEMS, voltage signal, LC tank circuit
Method for diagnosing digital mems microphone abnormality and apparatus therefor
Patent published on the 2025-03-06 in WO under Ref WO2025048385 by SM INSTR INC [KR] (Kim Young Key [kr], Kim In Kwon [kr], Lee Kwang Hyun [kr], Jung Ook Jin [kr], Kim Yong Hyeon [kr])
Abstract: A method according to an embodiment of the present invention is for diagnosing a digital MEMS microphone abnormality and is performed by an acoustic device including a plurality of digital MEMS microphones, the method comprising the steps of: collecting time-series output decibel data for the respective array positions of each of a plurality of digital MEMS microphone arrays provided in the acoustic device when a pure sound of a preset first frequency is reproduced by a speaker in close contact [...]
Our summary: Method for diagnosing digital MEMS microphone abnormality using time-series output decibel data, evaluating abnormality with standard deviation, and outputting diagnosis result.
diagnosing, digital MEMS microphone, abnormality, apparatus
Patent
Finite Element Analysis of Soft-Pad Moldless Stamping of Bistable Circular Micro Shells
Published on 2025-02-28 by Mark M. Kantor, Asaf Asher, Rivka Gilat, Skava Krylov @MDPI
Abstract: Bistable microstructures are promising for implementation in many mictroelectromechanical system (MEMS)-based applications due to their ability to stay in several equilibrium states, high tunability and unprecedented sensitivity to external stimuli. As opposed to the extensively investigated one-dimensional curved beam-type devices of this kind, microfabrication of non-planar two-dimensional bistable structures, such as plates or shells, represents a remarkable challenge. Recently reported by us[...]
Our summary: Modeling methodology for stamping process of bistable micro shells, Understanding process parameters and material properties, Residual stresses and shell behavior.
Finite Element Analysis, Soft-Pad Moldless Stamping, Bistable Circular Micro Shells, Microfabrication
Publication
A Method for Fabricating Cavity-SOI and Its Verification Using Resonant Pressure Sensors
Published on 2025-02-28 by Han Xue, Xingyu Li, Yulan Lu, Bo Xie, Deyong Chen, Junbo Wang, Jian Chen @MDPI
Abstract: Cavity silicon on insulator (Cavity-SOI) offers significant design flexibility for microelectromechanical systems (MEMS). Notably, the shape and depth of the cavity can be tailored to specific requirements, facilitating the realization of intricate multi-layer structural designs. The novelty of the proposed fabrication methodology is manifested in its employment of a micromachining process flow, which integrates dry etching, wafer level Au–Si eutectic bonding, and chemical mechanic[...]
Our summary: Fabrication of Cavity-SOI using innovative micromachining process flow, validation with MEMS resonant pressure sensor, performance evaluation of sensors.
Cavity-SOI, MEMS, micromachining, resonant pressure sensors
Publication
A MEMS Pirani Vacuum Gauge Based on Porous Silicon
Published on 2025-02-28 by Yuzhe Lin, Zichao Zhang, Jifang Tao, Lianggong Wen @MDPI
Abstract: Vacuum gauges based on Micro-Electro-Mechanical System (MEMS) technology have the advantages of small size, high reliability, and low cost, so they are widely used in semiconductor, chemical, laboratory, and aerospace. In this paper, a high-reliability MEMS Pirani vacuum gauge based on a porous silicon platform is designed, fabricated, and characterized. The repeatability within 4~105 Pa has been tested. The porous silicon acting as a support material achieved a porosity of 68% and a thermal con[...]
Our summary: High-reliability MEMS Pirani vacuum gauge designed, fabricated, and characterized. Porous silicon platform achieves high porosity and thermal conductivity. Mechanical stability unaffected by shock and vibration.
MEMS, Pirani, Vacuum Gauge, Porous Silicon
Publication
Modeling and Implementation of Synchronization for Large-Aperture Electromagnetic MEMS Mirrors
Published on 2025-02-26 by Fahu Xu, Lingxiao Zhao @MDPI
Abstract: MEMS-based LiDAR has showcased extensive application potential in the autonomous driving sector, attributed to its cost-effectiveness, compactness, and seamless integration capabilities. However, MEMS LiDAR suffers from a short detection range, due to the small receiving aperture of the MEMS mirror. Our early study attempted to increase the detection range of MEMS LiDAR with a semi-coaxial design. In this paper, we further investigate the synchronization method for large-aperture electromagnetic[...]
Our summary: Modeling and Implementation of Synchronization for Large-Aperture Electromagnetic MEMS Mirrors, Investigation of synchronization method for large-aperture electromagnetic MEMS mirrors, Results show synchronous motion transfer model for 60 mm2 aperture mirrors.
Synchronization, Large-Aperture, Electromagnetic, MEMS
Publication
Method for In Situ On-Wafer Tensile Test of Thin Films
Published on 2025-02-26 by Xufeng Wang, Jiakang Li, Yi Chen, Jiawei Zhou, Leijian Cheng, Dacheng Zhang @MDPI
Abstract: This study addresses the need for a mechanical property characterization of films during Micro-Electro-Mechanical System (MEMS) processing by proposing a novel in situ on-wafer tensile strength testing method for film materials. This method integrates the film specimen with a bulk silicon test structure during fabrication, allowing for tensile strength measurements with a resolution of 0.05 MPa using only a probe and optical microscope. Utilizing this method, we successfully performed in situ on[...]
Our summary: Method for on-wafer tensile testing of thin films during MEMS processing, integrates film specimen with silicon test structure, enables measurements with 0.05 MPa resolution, validates potential for material characterization and process monitoring.
In Situ, On-Wafer, Tensile Test, Thin Films
Publication
Method of making acoustic devices with edge corrugation
Patent published on the 2025-02-11 in US under Ref US12225821 by SKYWORKS GLOBAL PTE LTD [SG] (Qian You [sg], Kumar Rakesh [sg], Chen Guofeng [us], Gu Myeong Gweon [kr], Park Myung Hyun [kr], Lee Jae Hyung [kr], Wurtz Michael Jon [us])
Abstract: A method of making an acoustic sensor (e.g., for use in a piezoelectric MEMS microphone) includes forming or providing a mold having one or more grooves in a top surface of the mold that extend in a direction of the length of the mold to a distal end of the mold. The method also includes forming or depositing a structure having one or more piezoelectric layers over the top surface of the mold to define a beam, the distal portion of the beam having a corrugated section including one or more groov[...]
Our summary: Method of making acoustic devices with edge corrugation by forming grooves in a mold, depositing piezoelectric layers, and releasing structure to increase acoustic resistance of the sensor gap.
acoustic devices, edge corrugation, piezoelectric MEMS microphone, cantilever beams
Patent
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