Product Design, Manufacturing & Innovation Resources

Publicações recentes e patentes em MEMS

MEMS

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Esta é a nossa mais recente seleção de publicações e patentes mundiais em inglês sobre MEMS, provenientes de diversas revistas científicas online, classificadas e focadas em MEMS.

Mems device

Patent published on the 2026-06-04 in US under Ref US20260152382 by MURATA MFG CO LTD [JP] (Partanen Mikko [fi])

Abstract: [0000] A MEMS device is provided with in-plane moving structures and translation beams to move a rotating structure out-of-plane. The arrangement of the translation beams contributes to the out-of-plane rotation of the rotating structure. Out-of-plane movement to the large tilt angles is achieved with lower voltage in comparison to two-layer tilting structures.[...]


Our summary: A MEMS device features in-plane moving structures and translation beams for out-of-plane rotation. The design allows for large tilt angles with lower voltage requirements. This arrangement enhances the efficiency of the rotating structure s movement.

MEMS, in-plane movement, out-of-plane rotation, translation beams

Patent

Tactile feedback sensor

Patent published on the 2026-05-28 in US under Ref US20260144608 by ARIZONA BOARD OF REGENTS ON BEHALF OF THE UNIV OF ARIZONA [US] (Govalla Dema [us], Rozenblit Jerzy [us])

Abstract: This invention provides systems and methods for tactile perception in robotic assisted minimally invasive surgery (RAMIS), focusing on deformation and texture detection. The system integrates microelectromechanical systems (MEMS) sensors and/or force-sensitive resistor (FSR) sensors attached to a thoracic grasper instrument and is compatible with the da Vinci MIS surgical system and other robotic surgical systems. The systems further utilize algorithms able to accurately classify objects with va[...]


Our summary: This invention enhances tactile perception in robotic assisted minimally invasive surgery. It integrates MEMS and FSR sensors with a thoracic grasper instrument. Algorithms classify objects based on softness and roughness for improved surgical outcomes.

tactile feedback, robotic surgery, MEMS sensors, texture detection

Patent

Ultrasound device, in particular for applications based on time-of-flight measurement, and control method

Patent published on the 2026-05-28 in US under Ref US20260147117 by STMICROELECTRONICS INT N V [CH] (Giusti Domenico [it], Passoni Marco [it], Barretta Luigi [it])

Abstract: [0000] An ultrasound device uses transmission transduction modules of MEMS type, where each transmission transduction module emits a respective ultrasound acoustic wave. Reception transduction modules of MEMS type are configured to each generate an electrical signal in response to the detection of an impinging ultrasound acoustic wave. Control circuitry includes one or more transmission channels configured to drive the emission of ultrasound acoustic waves by the transmission transduction module[...]


Our summary: The ultrasound device utilizes MEMS transduction modules for emitting and receiving acoustic waves. It employs time-of-flight measurement for accurate detection. Control circuitry manages the emission and reception of signals through dedicated channels.

Ultrasound, MEMS, time-of-flight, control circuitry

Patent

Improved capacitive microelectromechanical pressure transducer and related manufacturing process

Patent published on the 2026-05-27 in EP under Ref EP4749254 by ST MICROELECTRONICS INT NV [CH] (Capra Federica [it], Nicoli Silvia [it], D'ercoli Filippo [it])

Abstract: MEMS pressure transducer including: a semiconductor body; a fixed electrode region; and a membrane, which is suspended above the fixed electrode region so as to delimit a cavity, the membrane being deformable as a function of pressure. The membrane includes: a lower conductive region of polysilicon, which delimits the cavity at the top and is traversed by one or more holes which face the cavity, the lower conductive region being impermeable to gases, except for the holes; an intermediate structu[...]


Our summary: This invention relates to an improved capacitive MEMS pressure transducer and its manufacturing process. The transducer features a semiconductor body with a fixed electrode region and a deformable membrane that delimits a gas cavity. The membrane consists of a lower conductive region, an intermediate gas-permeable structure, and an upper conductive region, ensuring effective pressure measurement.

MEMS, pressure transducer, capacitive, polysilicon

Patent

Mems switch, packaged mems switch product and method of operating it

Patent published on the 2026-05-13 in EP under Ref EP4742289 by INFINEON TECHNOLOGIES AG [DE] (Timme Hans-jÖrg [de], Lohninger Gerhard [de], Ahrens Carsten [de])

Abstract: In accordance with an embodiment, a microelectromechanical system (MEMS) switch device includes: a substrate; a switching membrane disposed above the substrate; a pull-in electrode disposed above the switching membrane; a metal contact disposed on the switching membrane; and a pull-back electrode disposed below the switching membrane, wherein the switching membrane is movable between an open position and a closed position, and wherein in the closed position, the metal contact electrically connec[...]


Our summary: A MEMS switch device consists of a substrate, a movable switching membrane, and electrodes. The switch operates by moving the membrane between open and closed positions. In the closed position, the metal contact connects two RF signal lines.

MEMS switch, microelectromechanical system, RF signal lines, switching membrane

Patent

A method of manufacture of a micro-electric-mechanical system with a beam structure

Patent published on the 2026-05-13 in CZ under Ref CZ2024508 by FYZIKALNI USTAV AV CR V V I [CZ] (Kromka Alexander [cz], PotockÝ ŠtĚpÁn [cz], SzabÓ Ondrej [cz], Vanko Gabriel [cz])

Abstract: The submitted solution applies to the method of manufacture of a micro-electric-mechanical system (MEMS) with a beam structure which includes the following steps: providing a substrate; depositing a sacrificial layer of silicon dioxide or silicon nitride on the substrate; cutting or etching a part in the sacrificial layer to support the beam structure using a laser-assisted machining, wet etching or dry etching whereas the sacrificial layer is removed as far as the substrate; depositing a diamon[...]


Our summary: This method manufactures a micro-electric-mechanical system (MEMS) with a beam structure. It involves depositing a sacrificial layer, etching to support the beam, and using laser techniques for precision. The process ensures high quality and durability of the MEMS components.

MEMS, beam structure, laser-assisted machining, sacrificial layer

Patent

Real-Time Axle-Load Sensing and AI-Enhanced Braking-Distance Prediction for Multi-Axle Heavy-Duty Trucks

Published on 2026-02-03 by Duk Sun Yun, Byung Chul Lim @MDPI

Abstract: Accurate braking-distance prediction for heavy-duty multi-axle trucks remains challenging due to the large gross vehicle weight, tandem-axle interactions, and strong transient load transfer during emergency braking. Recent studies on tire&amp;ndash;road friction estimation, commercial-vehicle braking control (EBS/AEBS), and weigh-in-motion (WIM) sensing have highlighted that unmeasured vertical-load dynamics and time-varying friction are key sources of prediction uncertainty. To address thes[...]


Our summary: This study presents a framework for real-time axle-load sensing and AI-enhanced braking-distance prediction for heavy-duty trucks. It integrates dynamic load estimation with friction sensing and machine learning to improve prediction accuracy. The results show significant enhancements in braking-distance predictions compared to traditional methods, supporting advanced driver-assistance and safety management systems.

Axle-Load Sensing, Braking-Distance Prediction, Machine Learning, Heavy-Duty Trucks

Publication

Investigation of III-Nitride MEMS Pressure Sensor for High-Temperature Applications

Published on 2026-01-28 by Makhluk Hossain Prio, Maruf Morshed, Lavanya Muthusamy, Md Sohanur E. Hijrat Raju, Itmenon Towfeeq, Durga Gajula, Goutam Koley @MDPI

Abstract: High-temperature operation of AlGaN/GaN Heterojunction Field Effect Transistor embedded diaphragm-based MEMS pressure sensors have been investigated, which utilized their wide bandgap and piezo resistivity to perform stably at elevated temperatures. The performance of the pressure sensor was observed over a change in applied pressure of 35 kPa, which resulted in an experimentally measured change in drain&amp;ndash;source resistance (&amp;Delta;RDS/RDS(0)) of 0.32% at room temperature and[...]


Our summary: The study investigates a MEMS pressure sensor using AlGaN/GaN transistors for high-temperature applications. The sensor shows stable performance at temperatures up to 300 °C with a change in resistance of 0.65% at 250 °C. Finite Element simulations corroborate experimental results, indicating strong potential for reliable pressure sensing in harsh environments.

MEMS, III-Nitride, High-Temperature, Pressure Sensor

Publication

Tópicos abordados: diagnóstico, microfone MEMS digital, anormalidade, aparelho, Análise de Elementos Finitos, Estampagem sem Molde com Almofada Macia, Microconchas Circulares Biestáveis, Microfabricação, Cavidade-SOI, micromecanização, sensores de pressão ressonantes, medidor de vácuo Pirani MEMS, silício poroso, sincronização, grande abertura, eletromagnético, teste de tração, ASTM F2630, ISO 16063, IEC 62047, ISO/IEC 27001 e ISO 9001.

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