Latest Publications & Patents on MEMS

This week: Electrostatic actuation, MEMS, voltage signal, LC tank circuit, MEMS, Gas Sensor, γ-Fe2O3, Propane, diagnosing, digital MEMS microphone, abnormality, apparatus, Finite Element Analysis, Soft-Pad Moldless Stamping, Bistable Circular Micro Shells, Microfabrication, Cavity-SOI, MEMS, micromachining, resonant pressure sensors, MEMS, Sensor Arrays, Optimization, Feature Alignment, MEMS, Pirani, Vacuum Gauge, Porous Silicon, acoustic devices, edge corrugation, piezoelectric MEMS microphone, cantilever beams

August 3, 2025

Design for Additive Manufacturing (DfAM), Mechanical Engineering, Mechanical Properties, Micro-electromechanical Systems (MEMS), Micromachining, Process Optimization, Quality Control, Sensors

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This is our latest selection of worldwide publications and patents in english on MEMS, between many scientific online journals, classified and focused on MEMS.

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Method for diagnosing digital mems microphone abnormality and apparatus therefor

Patent published on the 2025-03-06 in WO under Ref WO2025048385 by SM INSTR INC [KR] (Kim Young Key [kr], Kim In Kwon [kr], Lee Kwang Hyun [kr], Jung Ook Jin [kr], Kim Yong Hyeon [kr])

Abstract: A method according to an embodiment of the present invention is for diagnosing a digital MEMS microphone abnormality and is performed by an acoustic device including a plurality of digital MEMS microphones, the method comprising the steps of: collecting time-series output decibel data for the respective array positions of each of a plurality of digital MEMS microphone arrays provided in the acoustic device when a pure sound of a preset first frequency is reproduced by a speaker in close contact [...]

Our summary: Method for diagnosing digital MEMS microphone abnormality using time-series output decibel data, evaluating abnormality with standard deviation, and outputting diagnosis result.

diagnosing, digital MEMS microphone, abnormality, apparatus

Patent

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Topics covered: diagnosing, digital MEMS microphone, abnormality, apparatus, Finite Element Analysis, Soft-Pad Moldless Stamping, Bistable Circular Micro Shells, Microfabrication, Cavity-SOI, micromachining, resonant pressure sensors, MEMS Pirani vacuum gauge, porous silicon, synchronization, large-aperture, electromagnetic, tensile testing, ASTM F2630, ISO 16063, IEC 62047, ISO/IEC 27001, and ISO 9001..