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Latest Publications & Patents on Titanium Metal

. Latest Publications & Patents on Titanium Metal. Aerospace

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This is our latest selection of worldwide publications and patents in english on Titanium Metal, between many scientific online journals, classified and focused on titanium and Ti-6Al-4V.

Positive electrode active material particles, method for manufacturing positive electrode active material particles, positive electrode, and all-solid

Patent published on the 2026-07-02 in WO under Ref WO2026141469 by CANON KK [JP] (Nagashima Yuujirou [jp], Kawaguchi Shintaro [jp], Ohmori Atsuhiko [jp], Toyoda Takayuki [jp])

Abstract: Provided are positive electrode active material particles with which it is possible to achieve both long life and low resistance. Each positive electrode active material particle comprises a core particle and a coating layer that coats the surface of the core particle. The core particle is formed of a first composite oxide. The first composite oxide contains lithium and at least one element selected from the group consisting of manganese, cobalt, nickel, aluminum, iron, and phosphorus. The coati[...]


Our summary: The content describes positive electrode active material particles designed for long life and low resistance. These particles consist of a core made from a first composite oxide and a coating layer of a second composite oxide. The coating layer has a high coverage percentage and specific thickness parameters.

positive electrode, active material, composite oxide, all-solid

Patent

Integrated circuits with thermal management layers for improved heat dissipation

Patent published on the 2026-07-02 in US under Ref US20260190984 by INTEL CORP [US] (Pantuso Daniel [us], Ramayya Edwin B [us], Landon Colin D [us], Kobrinsky Mauro J [us], D'silva Joseph [us], Jiang Lei [us])

Abstract: Techniques are provided herein to form semiconductor dies with a thermally conductive bond interface to enhance the thermal dissipation from the semiconductor devices. A frontside interconnect region is provided above a semiconductor device layer to, for example, route signals between various semiconductor devices in the device layer. A thermally conductive bond layer may be provided above the frontside interconnect region, such as on a top-most layer of the frontside interconnect region. The th[...]


Our summary: This content discusses integrated circuits featuring thermal management layers to improve heat dissipation. It describes techniques for forming semiconductor dies with a thermally conductive bond interface. Additionally, it outlines the use of a frontside interconnect region for signal routing between semiconductor devices.

thermal management, integrated circuits, semiconductor devices, heat dissipation

Patent

Line pipe steel and manufacturing method therefor

Patent published on the 2026-07-02 in WO under Ref WO2026142060 by HYUNDAI STEEL CO [KR] (Yoon Dong Hyun [kr], Kim Hyeong Sub [kr], Song Min Young [kr], Lee Ho Hyeong [kr])

Abstract: The present invention provides line pipe steel comprising, by wt%, 0.04-0.07% of carbon (C), 0.20-0.30% of silicon (Si), 1.2-1.35% of manganese (Mn), 0.02-0.05% of aluminum (Al), 0.10% or less (excluding 0%) of copper (Cu), 0.15-0.25% of chromium (Cr), 0.02-0.08% of molybdenum (Mo), 0.15-0.25% of nickel (Ni), 0.04-0.05% of niobium (Nb), 0.01-0.018% of titanium (Ti), 0.025%-0.035% of vanadium (V), 0.01% or less (excluding 0%) of phosphorus (P), 0.001% or less (excluding 0%) of sulfur (S), 0.0005%[...]


Our summary: The invention details a line pipe steel with specific chemical compositions. It includes various alloying elements to enhance properties. The steel achieves a relative notch tensile strength of 0.86 or greater.

line pipe steel, manufacturing method, chemical composition, tensile strength

Patent

Electrophotographic photoreceptor, process cartridge, and image forming apparatus

Patent published on the 2026-07-01 in EP under Ref EP4769023 by KYOCERA DOCUMENT SOLUTIONS INC [JP] (Senda Tetsuya [jp], Yamasaki Ryohei [jp])

Abstract: [0001] An electrophotographic photoreceptor according to the present disclosure is used in an image forming apparatus using a non-magnetic one-component pulverized toner. The electrophotographic photoreceptor includes: an undercoat layer provided on a conductive base; and a photosensitive layer in which a charge generating layer (4a) and a charge transporting layer (4b) are stacked in order on the undercoat layer. The undercoat layer includes a thermosetting resin including an alkyd resin and a [...]


Our summary: An electrophotographic photoreceptor is designed for use with a non-magnetic one-component pulverized toner in an image forming apparatus. It features an undercoat layer on a conductive base and a photosensitive layer composed of a charge generating layer and a charge transporting layer. The materials used include thermosetting resins, titanium oxide particles, and specific binder resins with hole transporting agents.

Electrophotographic, photoreceptor, toner, image forming

Patent

Printed circuit board and semiconductor package

Patent published on the 2026-06-25 in WO under Ref WO2026133769 by NITERRA CO LTD [JP] (Kan Yohei [jp], Otsuka Jun [jp], Torazawa Masahiro [jp], Okayama Hiroki [jp])

Abstract: Provided is a printed circuit board comprising: a ceramic substrate that has silicon nitride as a main component; a conductive part that is formed of an electroconductive material and is connected to a semiconductor element; and a bonding part that bonds the ceramic substrate and the conductive part, contains titanium, and has a plurality of protrusions on a surface in contact with the ceramic substrate. The plurality of protrusions are formed of titanium nitride, and the average of the ratio of[...]


Our summary: The printed circuit board includes a ceramic substrate primarily made of silicon nitride. It features a conductive part connected to a semiconductor element and a bonding part containing titanium. The bonding part has protrusions made of titanium nitride, with a specific aspect ratio.

printed circuit board, semiconductor package, ceramic substrate, titanium nitride

Patent

Olefin copolymerization solid catalyst component mixture, olefin copolymerization catalyst, and production method for olefin copolymer

Patent published on the 2026-06-25 in WO under Ref WO2026134214 by TOHO TITANIUM CO LTD [JP] (Ishikawa Teppei [jp], Bauch Christopher Garland [jp])

Abstract: Provided is an olefin copolymerization solid catalyst component mixture that makes it possible to easily produce an olefin copolymer that has both excellent rigidity and excellent impact resistance relative to similar polymerization conditions. An olefin copolymerization solid catalyst component mixture according to the present invention is characterized by containing a first olefin copolymerization solid catalyst component that includes magnesium, titanium, a halogen, and a succinic acid dies[...]


Our summary: The invention provides a solid catalyst component mixture for olefin copolymerization. It enables the production of olefin copolymers with excellent rigidity and impact resistance. The mixture consists of two distinct solid catalyst components containing specific metal and acid compounds.

olefin copolymerization, solid catalyst, rigidity, impact resistance

Patent

A Deep-Sea Multi-Sequence Sampling System Integrating In Situ Microbial Filtration with Rapid RNA Stabilization

Published on 2026-02-03 by Wei Bu, Yuan-Jie Chen, Jinhai Luo, Linlin Sun, Xiang Li, Xinyuan Gao, Yuanli Fang, Leisheng Tang, Jiaying Zhao, Jingchun Feng, Haocai Huang @MDPI

Abstract: Rapid depressurization and warming during recovery can trigger stress in deep-sea microbes and accelerate RNA degradation. We developed a remotely operated vehicle (ROV)-oriented multi-sequence microbial sampler for 2000 m sampling (20 MPa, 2 &amp;deg;C) that integrates in situ filtration with immediate RNAlater injection (an RNA stabilization reagent), collecting up to 12 samples per dive. A Dirichlet sampling&amp;ndash;B-spline&amp;ndash;SVM framework was used to optimize the cam p[...]


Our summary: A multi-sequence microbial sampler was developed for deep-sea environments, integrating in situ filtration with RNAlater injection. The design optimizes actuation under constraints, reducing torque requirements significantly. Computational fluid dynamics modeling predicts membrane clogging and RNAlater displacement dynamics during operation.

microbial sampling, RNA stabilization, computational fluid dynamics, remotely operated vehicle

Publication

Assessing the Potential of Heterotrophic Bioleaching to Extract Metals from Mafic Tailings

Published on 2026-02-02 by Kamalpreet Kaur Brar, Avi Du Preez, Nancy N. Perreault @MDPI

Abstract: Mafic mine tailings are highly resistant to bioleaching due to their silicate-rich composition, low sulfide content, and strong buffering capacity. This study aimed to assess the potential use of heterotrophic bioleaching to promote the release of metals from mafic tailings by evaluating the organic acid production and leaching capabilities of indigenous bacterial isolates and a known lactic acid producer, Lactiplantibacillus plantarum ATCC 8014. Indigenous acid-producing heterotrophic bacteria [...]


Our summary: This study evaluates heterotrophic bioleaching for metal extraction from mafic tailings. Indigenous bacteria and Lactiplantibacillus plantarum produced significant organic acids, enhancing metal solubilization. Zinc was efficiently leached, indicating selective mobilization potential despite limitations for refractory metals.

Bioleaching, Heterotrophic bacteria, Organic acids, Metal recovery

Publication

Topics covered: Titanium Metal, Ti-6Al-4V, Multi-Objective Optimization, Milling, Sustainability Performance, Microstructure, Mechanical Properties, Austenitic Stainless Steel, In Situ Testing, PMOS Transistor, Performance, N-metal Layer, Diamond-like Carbon Coatings, Plasma-assisted Chemical Vapor Deposition, Corrosion Behavior, Wear Resistance, Nano-Polycrystalline Pure Ti, ISO 5832-3, ASTM F136, ASTM B348, ISO 13715, and ASTM F1472..

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