[innov_rss_filter topic=”MEMS” kw=”MEMS” logic=”OR” qty=”6″]
- Última actualización: 19 de febrero de 2025
- This week: Vacuum packaging, MEMS, Micro-oven, Wafer-level, deflection, stress analyses, removal uniformity, silicon wafer, polishing machine, pressure, CMP, MEMS, Tuning Fork Gyroscope, Analysis, Simulation, MEMS accelerometers, Structural Health Monitoring, seismic excitation, sensor types, seismic vulnerability, self-noise, Operational Modal Analysis, design, fabrication, piezoelectric, Al0.8Sc0.2N, MEMS, reliability, dynamic range, structural design, MEMS capacitive microphones, microstructures, equivalent circuit models, Finite Element Analysis (FEA), MEMS, directional, microphone, adhesive, Electrodes, Microelectromechanical Systems, MEMS, Capacitor
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