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| Date* | Country ** | Status | Ref | id | Title | abstract | Applicant | Origin *** | Inventors | Details | Full |
|---|---|---|---|---|---|---|---|---|---|---|---|
| 2024-10-16 | TW | A | TW202441909 | 3.000 | Sensing device capable of being miniaturized by shortening a length of a case in a first direction | The present invention aims to provide a sensing device that can be miniaturized by shortening a length of a case in a first direction. A sensing device has a plurality of switches and is provided with: a case having a first wall part and a second wall part opposite to the first wall part; a substrate housed in a space between the first wall part and the second wall part of the case and having a first surface opposite to the second wall part and a second surface opposite to the first wall part; a first switch disposed on the first surface of the substrate; a second switch disposed on the second surface of the substrate at a position deviated from the first switch along the first direction parallel to an outer edge of the case; a first flexible member protruding from the first wall part of the case, extending in a second direction perpendicular to the first direction and configured to be contact with the first switch; and a second flexible member protruding from the second wall part of the case, extending in the second direction, and configured to be in contact with the second switch. The first switch and the second switch that are adjacent in the first direction at least partially overlap in the first direction. A first arrangement area where the first switch is arranged and a second arrangement area where the second switch is arranged at least partially overlap in the first direction. | PANASONIC IP MAN CO LTD [JP] | JP | Imamura Shinya [jp] | ||
| 2024-10-16 | TW | A | TW202441901 | 3.001 | Configurable voltage regulator circuit and transmitter circuit | A voltage regulator circuit includes a first amplifier, a second amplifier and a transistor. Respective first input terminals of the first and second amplifiers are coupled to a first reference voltage and a second reference voltage, respectively. A connection terminal of the transistor is coupled to a supply voltage. A control terminal of the transistor is selectively coupled to one of respective output terminals of the first and second amplifiers. When the control terminal of the transistor is coupled to the output terminal of the first amplifier, another connection terminal of the transistor is coupled to a second input terminal of the first amplifier to output a regulated voltage. When the control terminal of the transistor is coupled to the output terminal of the second amplifier, the another connection terminal of the transistor is coupled to a second input terminal of the second amplifier to output the regulated voltage. | M31 TECH CORP [TW] | TW | Chang Ching-hsiang [tw], Chien Yu-hsun [tw] | ||
| 2024-10-16 | TW | A | TW202442023 | 3.002 | Method for performing channel management in wireless communication system, and associated apparatus | A method for performing channel management in a wireless communication system and associated apparatus are provided. The method may include: receiving, by the first wireless transceiver device, a channel switch request in a first communication frame from the second wireless transceiver device; and triggering a channel switch (CS) mechanism, by the first wireless transceiver device, to inform the second wireless transceiver device to switch from a first channel to a target channel, for subsequent communication of the second wireless transceiver device. | MEDIATEK INC [TW] | TW | Hsieh Kai-hsiang [tw], Chen Wei-xun [tw] | ||
| 2024-10-16 | TW | A | TW202441974 | 3.003 | Light detection device and electronic apparatus | To achieve high resolution and improve the image quality of a captured image. This light detection device comprises, as a stack, a first substrate on which a plurality of pixels are disposed, a second substrate on which a plurality of first pixel circuits and a plurality of second pixel circuits are disposed, and a third substrate on which a logic circuit is disposed. The first substrate has a plurality of first metal pads which are disposed facing the second substrate and have output nodes of the plurality of pixels connected thereto. The second substrate has a semiconductor layer which is disposed facing the third substrate, a plurality of second metal pads which are joined to the plurality of first metal pads, a plurality of first vias which are disposed so as to penetrate the semiconductor layer from the plurality of second pixel circuits, and a plurality of third metal pads which are disposed facing the third substrate and are connected to the plurality of first vias. The third substrate has a plurality of fourth metal pads which are joined to the plurality of third metal pads. Each of the plurality of first vias is disposed on the same axis as at least one transistor in a corresponding one or more first pixel circuits or in a corresponding one or more second pixel circuits. | SONY SEMICONDUCTOR SOLUTIONS CORP [JP] | JP | Bando Masashi [jp] | ||
| 2024-10-16 | TW | A | TW202442020 | 3.004 | A method of wireless communication and a device thereof | In an aspect of the disclosure, a method, a computer-readable medium, and an apparatus are provided. The apparatus may be a first UE. The first UE transmits a plurality of reference signals (RSs) using a plurality of transmission beams on a sidelink. The first UE receives, from a second UE, a beam report carried on a Physical Sidelink Feedback Channel (PSFCH). The beam report indicates beam qualities generated by the second UE based on measurements of the plurality of RSs. The first UE selects a transmission beam and a reception beam based on the beam qualities. The first UE establishes a sidelink communication with the second UE using the selected transmission beam and the selected reception beam on the sidelink. | MEDIATEK SINGAPORE PTE LTD [SG] | SG | Li Chen-meng [cn], Cheng Jun-qiang [cn], Chen Tao [cn], Cheng Ming-yuan [tw] | ||
| 2024-10-16 | TW | A | TW202442027 | 3.005 | Handling connection rejections via u2u relay associated with backoff times on behalf of a source end wtru | Systems and methods are described herein for handling connection rejects via a wireless transmit/receive unit (WTRU)-to-WTRU (U2U) relay associated with backoff times on behalf of a source end WTRU. A relay WTRU may retry to establish connection with a target WTRU on behalf of a source WTRU, for example, based on receiving a rejection (e.g., with a backoff value) from the target WTRU. The source WTRU may associate the reject message to the target WTRU, and the relay WTRU may be available to reach other target WTRUs. The relay WTRU may send a reject message to other source WTRUs (e.g., if the back off duration is active, running) for the same target WTRU. | INTERDIGITAL PATENT HOLDINGS INC [US] | US | Sarathchandra Magurawalage Chathura Madhusanka [lk], Perras Michelle [ca], Ferdi Samir [ca], Abbas Taimoor [se], Son Jung-je [kr], Ahmad Saad [ca] | ||
| 2024-10-16 | TW | A | TW202441872 | 3.006 | Reconnection control apparatus and power system | A reconnection control apparatus controls a switch disposed between at least one DER system having droop characteristics and a power grid. The reconnection control apparatus comprising a first detecting unit to detect a first phase, a first frequency and a first amplitude of a voltage on a side of the DER system of the switch, a second detecting unit to detect a second phase, a second frequency and a second amplitude of a voltage on a side of the power grid of the switch and a reconnection control unit to reconnect the DER system to the power grid by outputting a power reference signal and a voltage reference signal to the DER system to match the first phase to the second phase, match the first frequency to the second frequency, and match the first amplitude to the second amplitude and closing the switch based on a difference between the first phase and the second phase and a difference between the first absolute and the second absolute. | MITSUBISHI ELECTRIC CORP [JP] | JP | Manohar Rutvikanandan [in], Inoue Sadayuki [jp], Matsumoto Koki [jp], Kojima Yasuhiro [jp], Matsuda Keishi [jp], Koshio Masanobu [jp], Kurose Ken [jp], Kawai Yu [jp] | ||
| 2024-10-16 | TW | A | TW202441857 | 3.007 | Waterproof connector assembly and its male-end waterproof connector and female-end waterproof connector | This application is a waterproof connector assembly and its male-end waterproof connector and female-end waterproof connector. The provided waterproof connector assembly can provide power or signal transmission between electronic devices, and has elastic rubber pads and elastic rubber rings to provide waterproof to prevent water vapor from penetrating the male-end waterproof connector and the female-end waterproof connector, thereby preventing water vapor from penetrating electronic equipment, so as to reduce the degree to which the operation of electronic equipment is affected by water vapor, and even prevent electronic equipment from being affected by water vapor affected by damage. | TARNG YU ENTERPRISE CO LTD [TW] | TW | Chin Ying-chieh [tw], Chen Ying-chung [tw], Huang Mu-jung [tw] | ||
| 2024-10-16 | TW | A | TW202441846 | 3.008 | Low profile board-to-board interface contactors | Low profile board-to-board interface contactors are described. In one example, a board- to-board interface contactor includes a shield body housing, a shield lid over the shield body housing, an insulating interposer within the shield body housing, a press-biased conductive pin, and a compression member. The shield body housing includes a spring contact arm. The shield lid is positioned over the shield body housing and is seated upon the spring contact arm. The shield lid includes a central contactor opening through which the conductive pin can extend to facilitate electrical contact for the communication of a radio frequency signal. The insulating interposer is positioned within the shield body housing, with the press-biased conductive pin extending through an aperture in the insulating interposer. The compression member is positioned with the insulating interposer, under the press-biased conductive pin, and the compression member applies a compression bias against a bottom surface of the conductive pin. | MOLEX LLC [US] | US | Antonini Gino Stephen [us], White Daniel Ardell [us], Spink Jr [us], Borrelli Jr [us], Bharadwaj Bharath Dattatri [in], Mendes Jean-louis [se], Tagan Kevin J [us] | ||
| 2024-10-16 | TW | A | TW202441849 | 3.009 | Electrical connector | An electrical connector can provide sufficient routing space for the matching conductive wires, so as to reduce the stacking height of the conductive wires when routing, so that the height of the internal space of the electronic device occupied by the electrical connector and the matching conductive wires meets expectations. In addition, the provided electrical connector can guide the conductive wires to go out laterally, so that the conductive wires can extend laterally inside the electronic device, making it easy to organize the conductive wires inside the electronic device, and even prevent abnormal occurrence of the conductive wires inside the electronic device, so that the electronic equipment can continue to develop in the direction of thinning. | TARNG YU ENTERPRISE CO LTD [TW] | TW | Huang Mu-jung [tw], Chen Tsung-chi [tw] | ||
| 2024-10-16 | TW | A | TW202441979 | 3.010 | Electrodes for microelectromechanical system microphones | The present invention relates to split electrodes for microelectromechanical system (MEMS) microphones. In one embodiment, a MEMS sensor includes a membrane, a membrane electrode formed in a portion of the membrane, and a backplate situated parallel to the membrane and separated by a gap. The backplate includes a first region of the backplate, where the first region of the backplate has first perforations of a first density, a backplate electrode is formed in a portion of the first region of the backplate, and a portion of the membrane electrode overlaps a portion of the backplate electrode in a sensing region forming a sensing capacitor, the sensing capacitor being configured to sense motion of the membrane in response to acoustic pressure. The backplate also includes a second region of the backplate having second perforations of a second density, where the second density is greater than the first density. | TDK ELECTRONICS AG [DE] | DE | Seeger Joseph [us], Mortensen Dennis [us] | ||
| 2024-10-16 | TW | A | TW202442034 | 3.011 | High-power compact vuv laser-sustained plasma light source | A compact LSP broadband light includes a gas containment structure containing a mixture of a first noble gas and a second noble gas, a filter tube positioned within the gas containment structure, an input window, and a pump source. The laser pump source directs an optical pump through the input window to sustain a plasma within the filter tube. The first noble gas absorbs broadband light within a first and a second wavelength band. The filter tube absorbs broadband light having a wavelength below a selected threshold. The absorption of broadband light by the first noble gas and the filter tube provide long-pass filtering to protect one or more downstream optical elements. The gas containment structure includes an output optical window for transmission of filtered broadband light. The gas containment structure includes a gas inlet and outlet for generating a reverse vortex flow pattern within the filter tube. | KLA CORP [US] | US | Bezel Ilya [us] | ||
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