マイクロLEDディスプレイは発光型フラットパネルです テクノロジー 無機窒化ガリウムから作られている 導かれた chips with individual pixel dimensions typically below 100 micrometres, delivering luminance levels, contrast ratios, and operational lifespans that neither OLED nor LCD architectures can match at equivalent pixel densities. The fundamental 製造 problem — transferring billions of defect-free microscale die from epitaxial wafers onto active-matrix backplanes at production-viable speed and yield — remains the central bottleneck separating laboratory demonstrations from mass-market panels, driving intense 特許 質量移動法、レーザーリフトオフ、自己組織化、および冗長性に基づく修復戦略に関する活動。

材料面では、チップ寸法が小さいと効率が低下し、色変換は 量子ドット フィルター、そして単一のGaN基板上に赤、緑、青の発光体を一体化することは、活発な研究分野である。
下流アプリケーションには、AR/VR導波路結合マイクロディスプレイ、高輝度車載HUD、大型直視型ビデオウォール、および ウェアラブル 電力予算と形状によって放射効率が譲れない要件となるデバイス。
以下に索引付けされている出版物および特許は、エピタキシャル成長とチップの個別化から、バックプレーン統合、駆動回路、カラーマネジメント、システムレベルのディスプレイアーキテクチャに至るまで、このフルスタックを網羅しています。
これは、マイクロLEDディスプレイに関する英語の世界中の出版物と特許の最新のセレクションです。多数のオンライン科学ジャーナルから、マイクロLED、μLED、LEDエピタキシー、マストランスファーマイクロLED、ピックアンドプレースマイクロLED、マイクロLEDバックプレーン、TFTバックプレーンマイクロLED、マイクロLEDウェーハボンディング、LEDチップシングレーション、マイクロLEDピクセルピッチ、モノリシックマイクロLED、マイクロLEDアレイ、GaNマイクロLED、マイクロLEDに分類され、焦点を絞っています。
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Imaging device, imaging system, and method for manufacturing the imaging system
Patent published on the 2026-06-24 in EP under Ref EP4763046 by TAIZHOU GUANYU TECH CO LTD [CN] (Hsu Shun-cheng [cn], Wei Li-chen [tw], Chen Huei-siou [tw], Hsu Kuo-cheng [tw])
Abstract: [0001] The disclosure relates to an imaging device, an imaging system, and a method for manufacturing the imaging system. The imaging system includes a processor and a distal system. The distal system is electrically connected to the processor. The distal system includes an image sensor structure and a light emitting device. The light emitting device includes an organic light emitting device (OLED), a micro light emitting diode (micro-LED), a quantum dot light emitting diode (QLED), or any combi[...]
Our summary: The document describes an imaging device and system that includes a processor and a distal system. The distal system features an image sensor structure and a light emitting device, which can be OLED, micro-LED, or QLED. The organic light emitting device is structured with electrodes and reflective surfaces to create a micro resonant cavity.
imaging device, imaging system, OLED, micro-LED
Patent
Micro-led with improved light extraction efficiency
Patent published on the 2026-06-11 in US under Ref US20260164855 by META PLATFORMS TECH LLC [US] (Mezouari Samir [gb], Breakspear Robert Leslie [gb])
Abstract: [0000] A micro-LED includes a mesa structure and a tapered dielectric waveguide. The mesa structure includes a quantum well region disposed between an n-doped semiconductor layer and a p-doped semiconductor region. The n-doped semiconductor layer forms a tapered semiconductor pre-waveguide. The tapered dielectric waveguide has a lower refractive index than a higher refractive index of the tapered semiconductor pre-waveguide.[...]
Our summary: The micro-LED features a mesa structure with a quantum well region. It includes a tapered semiconductor pre-waveguide and a tapered dielectric waveguide. The dielectric waveguide has a lower refractive index compared to the semiconductor pre-waveguide.
micro-LED, light extraction, mesa structure, dielectric waveguide
Patent
Mechanisms for fabricating micro-leds
Patent published on the 2026-06-04 in US under Ref US20260156990 by SAPHLUX LLC [US] (Chen Chen [us], Song Jie [us])
Abstract: [0000] In some embodiments, methods for fabricating micro-LEDs may include bonding a semiconductor wafer to a Complementary Metal-Oxide-Semiconductor (CMOS) wafer via one or more adhesive layers, etching the LED epilayer and the one or more adhesive layers to form a plurality of micro-LED structures, and fabricating an electrode layer on the plurality of microLED structures. The semiconductor wafer may include an LED epilayer that may include an n-GaN layer, a p-GaN layer, and an active layer po[...]
Our summary: Methods for fabricating micro-LEDs involve bonding a semiconductor wafer to a CMOS wafer with adhesive layers. The process includes etching to form micro-LED structures and fabricating an electrode layer. A stress release pattern with geometrical shapes aids in managing mechanical stresses during fabrication.
micro-LEDs, semiconductor wafer, CMOS, fabrication
Patent
Partially stacking polychrome micro-led pixel
Patent published on the 2026-05-21 in WO under Ref WO2026102949 by JADE BIRD DISPLAY SHANGHAI LTD [CN] (Xu Qunchao [cn], Wei-sin Tan [cn])
Abstract: A polychrome Micro-LED pixel is provided. The pixel comprises: a first metal pillar formed on a substrate; a first LED structure that emits a first color, wherein the first LED structure is positioned on the first metal pillar; a second LED structure that emits a second color; a third LED structure that emits a third color, wherein the third LED structure is formed on the substrate, and the second LED structure is positioned above the third LED structure; a first conductive structure and a secon[...]
Our summary: The content describes a polychrome Micro-LED pixel with multiple color-emitting LED structures. It features a first metal pillar on a substrate supporting the first LED structure. Additionally, it includes conductive structures surrounding the LED components for electrical connectivity.
Micro-LED, Polychrome, Pixel Structure, Conductive Design
Patent
Polychrome micro-led pixel with non-coaxial stacking led structure
Patent published on the 2026-05-21 in WO under Ref WO2026103078 by JADE BIRD DISPLAY SHANGHAI LTD [CN] (Xu Qunchao [cn], Tan Wei-sin [cn])
Abstract: A polychrome Micro-LED pixel, comprising: a first LED structure that emits a first color, wherein the first LED structure is formed on a substrate; a first metal pillar formed on the substrate; a second LED structure that emits a second color, wherein the second LED structure is positioned on the first metal pillar; a first air gap around the first LED structure; a second air gap around the second LED structure; and a conductive structure surrounding the first LED structure and the second LED st[...]
Our summary: The content describes a polychrome Micro-LED pixel with a unique stacking design. It includes multiple LED structures emitting different colors, positioned on a substrate. The design features air gaps and a conductive structure for enhanced performance.
Micro-LED, pixel structure, non-coaxial stacking, conductive structure
Patent
Low power micro-led driver for high bandwidth short distance communication
Patent published on the 2026-05-07 in US under Ref US20260128800 by HYPERLUME INC [CA] (Nabavi Morteza [ca], Fariborzi Hossein [us], Nabavi Abdolreza [ca], Asad Mohsen [ca])
Abstract: [0000] A driver circuit for supplying and regulating power to a micro light-emitting diode (micro-LED), the driver circuitry comprising: at least one inverter; a first capacitance; a resistor coupled to ground; a fast switch comprising at least one first transistor; and a slow switch comprising at least one second transistor; whereby at least one of a rising time, a peaking effect, and LED power is increased.[...]
Our summary: This document describes a driver circuit designed for micro-LEDs. It includes components such as inverters, capacitors, and transistors. The circuit aims to enhance performance parameters like rising time and LED power.
micro-LED, driver circuit, low power, high bandwidth
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