Silicon Box Pte. Ltd.

Singapore

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Silicon Box Pte. Ltd. is an advanced semiconductor packaging and heterogeneous integration company headquartered in Singapore. Founded in 2021 by Dr. Byung Joon (BJ) Han, Dr. Sehat Sutardja, and Weili Dai, the company operates a state-of-the-art 73,000-square-meter manufacturing foundry in Singapore’s Tampines Wafer Park, developed with an initial $2 billion capital investment.

The company specializes in panel-level packaging (PLP) and chiplet interconnection technology, delivering sub-5-micron fabrication processes that create ultra-short interconnections between chiplets. This architecture bridges the gap in Moore’s Law, cutting power consumption by up to 40% and reducing package design cycle times and overall system packaging costs compared to traditional packaging schemes.

Silicon Box manufactures high-density chiplet modules used in artificial intelligence (AI), high-performance computing (HPC), automotive electric vehicles, data centers, mobile devices, robotics, and aerospace applications. The facility holds ISO 9001:2015, ISO 14001:2015, and ISO 45001:2018 certifications.

Offer

Silicon Box provides end-to-end design, advanced panel-level packaging, and backend integration services for chiplet-based integrated circuits:

Sub-5 Micron Interconnection Fabrication: Proprietary panel-level packaging process providing sub-5-micron line and space feature sizes for ultra-high interconnect density.
Heterogeneous Chiplet Integration: Packaging services integrating disparate dies—including compute cores, memory interfaces, analog controllers, and optical engines—into unified high-performance packages.
Panel-Level Packaging (PLP): Large-format panel manufacturing designed for scalable volume production, lowering unit costs compared to traditional wafer-level packaging.
Design & Architecture Consulting: Assisting semiconductor designers and fabless developers to partition monolithic system-on-chips (SoCs) into modular, yield-optimized chiplets.
Turnkey Backend Processing: Complete backend-of-line (BEOL) processing from panel assembly and interconnect formation through electrical characterization and reliability testing.

Silicon Box Pte. Ltd.

Offer

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