
La computación fotónica aprovecha los componentes basados en la luz para realizar cálculos a alta velocidad y bajo consumo energético. La fotónica de silicio permite integrar moduladores ópticos, detectores y guías de ondas en un solo chip. Las interconexiones ópticas reducen la latencia y los cuellos de botella del ancho de banda en la transferencia de datos. La óptica no lineal y las guías de ondas de cristal fotónico facilitan la conmutación óptica y la transmisión de datos. procesamiento de señales. Las redes neuronales fotónicas y los núcleos tensoriales aceleran las cargas de trabajo de aprendizaje automático. Punto cuántico Los láseres y las fuentes láser integradas proporcionan luz coherente para el cálculo. Las puertas lógicas y los resonadores ópticos implementan unidades de procesamiento fundamentales. La multiplexación por división de longitud de onda mejora el paralelismo en los canales de datos. Los avances en la fabricación de dispositivos fotónicos permiten arquitecturas escalables para los futuros sistemas informáticos.
Esta es nuestra última selección de publicaciones y patentes mundiales en inglés sobre computación fotónica, entre muchas revistas científicas en línea, clasificadas y centradas en computación fotónica, circuito integrado fotónico, interconexión óptica, fotónica de silicio, modulador óptico, red neuronal fotónica, láser de punto cuántico, óptica no lineal, guías de onda de cristal fotónico, procesamiento óptico de señales, multiplexación por división de longitud de onda, puerta lógica óptica, dispositivo plasmónico, fotodetector, amplificador óptico, computación óptica coherente, conmutación totalmente óptica, memoria fotónica, resonador óptico, peine de frecuencias, conversión óptica de frecuencias, núcleo tensor fotónico, arquitectura de computación óptica, computación cuántica fotónica, fuente láser integrada, desfasador óptico, computación analógica fotónica, almacenamiento óptico de datos, encaminamiento fotónico de señales, óptica ultrarrápida, fabricación de dispositivos fotónicos e informática fotónica.
Laser array integrated on photonic device and methods of making the same
Patent published on the 2026-06-11 in WO under Ref WO2026122557 by LI LI [US] (Lipson Michal [us], Molina Andres Gil [us], Raghunathan Vivek [us], Li Li [us])
Abstract: A device includes a photonic integrated circuit (PIC) and a laser module. A surface of the PIC defines a recess in the PIC. The PIC comprises: first waveguides partially disposed in the recess, optical splitters, second waveguides at least partially disposed in the PIC, and electrical contacts. The laser module is mounted on the surface of the PIC and comprises: a substrate spanning the recess and supported by the PIC at two opposing edges of the recess, and lasers each having an output port, th[...]
Our summary: The device integrates a laser module with a photonic integrated circuit (PIC). The PIC features waveguides, optical splitters, and electrical contacts. It generates a frequency comb using an optically nonlinear material coupled to second waveguides.
photonic integrated circuit, laser module, optical waveguides, frequency comb
Patent
System and method for edge-inserted wavelength-multiplexed diagonal-based photonic computing and control
Patent published on the 2026-06-11 in WO under Ref WO2026123016 by UNIV OF ROCHESTER [US] (Iyer Arjun [us], Renninger William [us])
Abstract: An exemplary system and method for distributed processing neural network (NN) or deep learning (DL) models by (i) optically encoding and multiplexing, at a transmitter (e.g., cloud server), a plurality of NN or DL model parameters into a single optical beam and (ii) processing, at a receiver (e.g., phone, computer, etc.), the plurality of NN or DL model parameters optically encoded within the single optical beam. By optically encoding a cyclically shifted offset diagonal of a weight matrix at a [...]
Our summary: The system encodes and multiplexes neural network parameters into a single optical beam for efficient processing. A receiver decodes these parameters using a single photodetector to perform matrix-vector multiplications. This method enhances distributed processing capabilities for deep learning applications.
wavelength-multiplexing, photonic computing, neural networks, deep learning
Patent
Optical network interface card and optical transmission apparatus
Patent published on the 2026-06-11 in US under Ref US20260160957 by AIP INC [TW] (Lee Chia [tw])
Abstract: An optical network interface card, adapted for use with at least an optical cable unit, includes a load board, a network chip disposed on the load board, at least an optical adapter installed on the load board for connection with the optical cable unit, a photonic integrated circuit disposed on the load board and electrically connected to the network chip, and an optical coupling assembly installed on the load board and connected between the optical adapter and the photonic integrated circuit.[...]
Our summary: The optical network interface card is designed for integration with optical cable units. It features a load board, network chip, and optical adapter. The card also includes a photonic integrated circuit and an optical coupling assembly for enhanced connectivity.
optical network interface card, optical transmission apparatus, photonic integrated circuit, optical coupling assembly
Patent
Vertically interconnected pic stack (vips) and method of manufacturing same
Patent published on the 2026-06-11 in US under Ref US20260160953 by PHASE SENSITIVE INNOVATIONS INC [US] (Prather Dennis [us], Shi Shouyuan [us], Yao Peng [us], Murakowski Janusz [us])
Abstract: [0000] A Vertically Interconnected PIC Stack (VIPS) provides high-density optical interconnections between stacked photonic integrated circuits (PICs). The stacked PICs are optically interconnected through optical connections formed in photonic via ports defined by an opening in a PIC or aligned openings in several of the PICs. The PICs can be implemented on different material platforms (e.g., Si, InP, or thin film lithium niobate (TFLN)) to support different functions. The process allows for co[...]
Our summary: A Vertically Interconnected PIC Stack (VIPS) enables high-density optical connections between stacked photonic integrated circuits (PICs). It utilizes optical connections formed through defined openings in the PICs, allowing for continuous stacking. The technology supports various material platforms to optimize functionality and compactness.
Vertically Interconnected PIC Stack, optical interconnections, photonic integrated circuits, manufacturing method
Patent
Light sensing device
Patent published on the 2026-06-11 in US under Ref US20260164913 by VISERA TECHNOLOGIES CO LTD [TW] (Chang Hsuan-chun [tw], Hsieh Chin-chuan [tw], Lin Wei-hsiang [tw])
Abstract: [0000] A light sensing device includes a light receiver that has a first organic photodetector (OPD) unit. The first OPD unit includes a bottom electrode unit, a first transport layer disposed on the bottom electrode unit, an active layer disposed on the first transport layer, a second transport layer disposed on the first active layer, and a top electrode disposed on the second transport layer. The first OPD unit generates a plurality of sensing currents in response to an input light received b[...]
Our summary: The light sensing device features an organic photodetector unit that generates sensing currents in response to light. It consists of multiple layers including transport and active layers. A processor is integrated to manage the outputs from the light receiver.
organic photodetector, light receiver, sensing currents, processor
Patent
Photonic fanout interposer
Patent published on the 2026-06-11 in US under Ref US20260160960 by LIGHTMATTER INC [US] (Gupta Shashank [in], Karhade Omkar [us], Harris Nicholas C [us])
Abstract: [0000] Described herein are systems and techniques for providing photonic devices having glass substrates for use in an optical interconnect system. The photonic devices comprise a glass substrate and one or more optoelectronic assemblies coupled through openings of the glass substrate. Waveguides of the optoelectronic assemblies may be optically coupled with waveguides of the glass substrate forming an optical network through the glass substrate. The assembly waveguides may be optically coupled[...]
Our summary: The content discusses systems for photonic devices using glass substrates in optical interconnects. It details the coupling of optoelectronic assemblies with waveguides through the glass substrate. Various coupling methods, including pluggable optical couplers and edge coupling, are mentioned.
Photonic devices, optical interconnect, glass substrate, waveguides
Patent
Asymmetric photon bunching recurring interferences and distributions via quantum frequency combs
Published on 2026-06-04 by Kai-Chi Chang, Xiang Cheng, Yujie Chen and Chee Wei Wong @IOP SCIENCE
Abstract: Quantum frequency combs (QFCs) exhibit periodic temporal recurrences arising from the Fourier transform of their mode-locked frequency spectra. While QFCs have been experimentally demonstrated, asymmetric Hong–Ou–Mandel (HOM) revival interference in QFCs has not been systematically investigated, and the efficient distribution of photon-bunching revivals has remained unreported. Here, we present the first experimental observation and distribution of asymmetric HOM recurrence interference usin[...]
Our summary: This study presents the first experimental observation of asymmetric Hong–Ou–Mandel revival interference using quantum frequency combs. The research demonstrates high visibility in HOM revivals across multiple time-bins from QFCs. Results indicate that QFCs are suitable for advanced quantum information processing applications.
quantum frequency combs, asymmetric Hong–Ou–Mandel interference, photon bunching, quantum information processing
Publication
quantum dot lasers and the end of the optical isolator
Published on 2026-05-08 by Shujie Pan, Junjie Yang, Siming Chen @NATURE
Abstract: Light: Science & Applications, Published online: 08 May 2026; doi:10.1038/s41377-026-02290-wQuantum dot (QD) lasers enable intrinsically feedback-tolerant, isolator-free silicon photonic integrated circuits (PICs), eliminating the bulky optical isolators traditionally required to suppress destabilizing reflections. Owing to their delta-function-like density of states, near-zero linewidth enhancement factor, and strong damping, QD lasers sustain stable, high-speed operation without coherence [...]
Our summary: Quantum dot lasers eliminate the need for optical isolators in silicon photonic integrated circuits. They provide stable, high-speed operation under extreme optical feedback. This technology facilitates compact and scalable optical interconnects for industrial applications.
quantum dot lasers, optical isolators, silicon photonics, integrated circuits
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