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Inari Amertron Berhad
Malaysia
RF & Wireless Modules: Bluetooth, LoRa, Wi-Fi, and Cellular modules

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Inari Amertron Berhad is a premier Malaysian semiconductor packaging and Outsourced Semiconductor Assembly and Test (OSAT) corporation established in 2006, with corporate offices in Petaling Jaya and principal manufacturing operations centered across multiple plants in Bayan Lepas, Penang.

Listed on the Main Market of Bursa Malaysia, Inari is recognized globally as an essential manufacturing partner for leading semiconductor multinationals, specializing in high-volume radio frequency (RF) front-end modules and advanced System-in-Package (SiP) solutions for mobile devices and high-speed communications.

Offer

Inari Amertron provides comprehensive advanced packaging, fabrication, and testing services for high-frequency RF modules and microelectronic systems:

  • RF Front-End Modules: High-volume assembly and testing of multi-band RF modules, power amplifier modules, and RF switches utilized in 4G and 5G cellular communication platforms.
  • System-in-Package (SiP) & SOM: Advanced micro-packaging integrating RFICs, passive components, and filters onto compact substrates using double-sided molding and flip-chip technologies.
  • Optoelectronics & Photonics Transceivers: Assembly and testing of high-speed optical transceivers and data-center optical communication engines.
  • Wafer Processing & RF Testing: Wafer bumping, precision sawing, plasma etching, back-grinding, cantilever/tight-tolerance RF probing, and automated package testing under rigorous temperature controls.

Tags

pcba
rf modules
semiconductors
5g modules
system-in-package
rf front-end
osat
Industrial Specializations: RF & Wireless Modules: Bluetooth, LoRa, Wi-Fi, and Cellular modules
Headquarter/main address: D-07-03, Plaza Kelana Jaya, Jalan SS7/13A, Kelana Jaya
Petaling Jaya
Selangor 47301
Malaysia
Get Directions
https://www.inari-amertron.com
Business Type: Manufacturer
Ownership: Public
Turnover: €250M+
Employees: 5,000-19,999
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