innovation.world
Product Design, Manufacturing & Innovation Resources
to Suppliers Directory
to Suppliers Detailed Search

AcSiP Technology Corp.
Taiwan
Embedded Systems & Firmware: Low-level programming for hardware control
RF & Wireless Modules: Bluetooth, LoRa, Wi-Fi, and Cellular modules
Wireless & RF Engineering: Antenna design and wireless protocol integration

All business names, logos, and images are used for informational purposes only. If you are the owner of any image or content displayed and wish to remove or update it, please contact us. By claiming your listing – see link at the bottom- you can upload your official media and desired texts.

AcSiP Technology Corp. (Advanced Communication System in Package) was established in 2009 and is headquartered in Taoyuan City, Taiwan. The company specializes in the development of miniaturized wireless communication System-in-Package (SiP) modules and system integration services for the Internet of Things (IoT).

AcSiP focuses on LPWAN and short-range wireless connectivity solutions, collaborating with semiconductor suppliers like Semtech, STMicroelectronics, and MediaTek. The company provides size shrinkage, RF design, and pre-integrated firmware to help clients deploy compact, battery-efficient smart devices.

  • Headquartered in Taoyuan City, Taiwan
  • Pioneer in LoRaWAN and Sigfox SiP miniaturization and integrated antenna designs
  • Strategic partnerships with STMicroelectronics and Semtech for LPWAN MCU and transceiver packaging

Offer

AcSiP offers a broad spectrum of miniaturized wireless connectivity modules and SiP platforms:

  • LoRa & LPWAN Modules: Modules and SiPs based on Semtech SX1262, SX1268, LR1121, LR2021, and STMicroelectronics STM32WL microcontrollers (e.g., ST50H, ST50HE, S76S, S68F, AI50H), supporting global LoRaWAN frequencies (EU868, US915, AS923, AU915, CN470) and Sigfox.
  • Wi-Fi & Bluetooth SiP Modules: Ultra-compact Wi-Fi 6 (802.11ax) + Bluetooth LE 5.4 combo modules (such as AI917L and AI7931LD based on MediaTek Filogic SoCs) with integrated ARM Cortex-M33/M4 processors and power management units.
  • IoT Protocol Support: Native hardware and software support for Matter and Thread protocols alongside Wi-Fi and BLE.
  • System-in-Package Services: Full-cycle SiP packaging, circuit miniaturization, antenna impedance matching, and shielding design.
  • Development Platforms: Dedicated evaluation boards and starter kits (EK-ST50H, EK-AI7931LD) with source libraries and AT command firmware.

Tags

bluetooth modules
wi-fi modules
lora modules
lorawan
system-in-package
matter
sip modules
semtech lora
Industrial Specializations: Embedded Systems & Firmware: Low-level programming for hardware control, RF & Wireless Modules: Bluetooth, LoRa, Wi-Fi, and Cellular modules, and Wireless & RF Engineering: Antenna design and wireless protocol integration
Headquarter/main address: Rm. 1, 3F., No. 207, Fuxing Rd., Taoyuan Dist.
Taoyuan City
Taiwan 33066
Taiwan
Get Directions
https://www.acsip.com.tw
Business Type: Manufacturer
Ownership: Public
Report Company Listing

Report anything not OK with the listing of this company.

Or use our > Contact Form < for more general topics.

The claim button will appear here only to logged-in users

100% Free. Permits to edit, correct or complete the listing above. Free advert for your company.
To prove ownership, you must be registered on this site with a verified email of the same domain as the company.

Submit you own company

Register your own company. 100% Free.
Free advert & link to your company.
To prove ownership, you must be registered on this site with a verified email of the same domain as the company.

10th year anniversary

Full size images and downloads are only available, 100% free, for registered members.

> Login <