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Dernières publications et brevets sur les MXènes

MXènes

This is our latest selection of worldwide publications and patents in english on MXenes, between many scientific online journals, classified and focused on mxene, Lewis acid molten salt etching, HF etching, MAX phase, divacancy MXene, ordered double-transition-metal, ML‑MXene, Lewis acid molten salt, divacancy MXene, ordered double transition metal, solid-solution MXenes, FL‑MXene, multi-layer MXene, nearly-free electron and Tyndall scattering.

Types, Synthesis, and Recent Advances in Supercapacitor Applications

Published on 2025-07-04 by Zhiwei Gao, Donghu Shi, Jiawei Xu, Te Hai, Yao Zhao, Meng Qin, Jian Li @MDPI

Abstract: Since the discovery of two-dimensional transition metal carbides and nitrides (MXenes), MXenes have attracted widespread research in the academic community due to their advantages, such as adjustable interlayer spacing, excellent hydrophilicity, conductivity, compositional diversity, and rich surface chemical composition. More than 100 different MXene combinations can be calculated theoretically, but only more than 40 have been successfully synthesized through experiments. Among the many synthes[...]


Our summary: Types, Synthesis, and Recent Advances in Supercapacitor Applications. MXenes, including vanadium-based carbide MXenes, have adjustable interlayer spacing, excellent hydrophilicity, and rich surface chemical composition. Over 40 MXene combinations have been successfully synthesized, with vanadium-based carbide MXenes showing promising energy storage applications.

Supercapacitors, MXenes, Synthesis, Applications

Publication

3d printable thermal management composite for flexible wireless communication electronic devices

Patent published on the 2025-03-20 in WO under Ref WO2025058564 by NANYANG TECHNOLOGICAL UNIV [SG] (Bark Hyunwoo [sg], Lee Pooi See [sg])

Abstract: The current invention relates to an ink formulation for additive manufacture, the ink formulation comprising a photocurable siloxane polymer, a photocurable silane, and one or more fillers, wherein the one or more fillers comprises particles of a core-shell material, where the core is formed from a phase change material and the shell is formed from a silane, and optionally a 2D MXene[...]


Our summary: Ink formulation for additive manufacture with photocurable siloxane polymer, silane, and core-shell material fillers for flexible wireless communication electronic devices.

thermal management, 3D printable, composite, flexible

Patent

Surface-enhanced raman spectroscopy chip and manufacturing method thereof

Patent published on the 2025-03-13 in WO under Ref WO2025053724 by KOREA ADVANCED INSTITUTE OF SCIENCE AND TECH [KR] (Lee Yong Hee [kr], Ahn Chi Won [kr], Kim Seung Hyun [kr], Han Hee [kr], Cho Su Ho [kr], Jang Moon Jeong [kr], Chae Kwan Byung [kr], Choi So Dam [kr], Ha Hwi Heon [kr])

Abstract: One embodiment of the present invention relates to a two-dimensional MXene-based surface-enhanced Raman spectroscopy chip and a manufacturing method thereof, wherein an MXene layer is formed on a substrate having a 3D nanostructure, thereby enhancing a SERS amplification effect, and the amplification effect becomes higher as the thickness decreases at a thin thickness of 5 nm or less, and provides a surface-enhanced Raman spectroscopy chip, comprising: a substrate; and an Mxene layer positioned [...]


Our summary: Two-dimensional MXene-based SERS chip with enhanced amplification effect on 3D nanostructure substrate, higher amplification at thickness less than 5 nm, substrate with MXene layer.

Surface-enhanced Raman spectroscopy, manufacturing method, MXene, nanostructure

Patent

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    Sujets abordés : Éléments des terres rares, revêtement de barrière thermique, microstructure, propriétés mécaniques, synthèse par combustion en solution, dureté Vickers, résistance à la rupture, dilatation thermique, effet Hall, dopé, pérovskite, résistance à la corrosion, essai de cycle thermique, affinement des grains, performance à haute température, densité des porteurs de charge, propriétés de transport, Organisation internationale de normalisation (ISO), ASTM International, American National Standards Institute (ANSI), Commission électrotechnique internationale (CEI), et Organisation internationale de normalisation (ISO).

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