最新出版物——钝化发射极和背面电池（PERC）专利
This week: thermoelectric conversion, contact resistance, production method, MgAgSb, Photovoltaic cell, ALD deposition, PECVD deposition, conversion efficiency, Semiconductor, Seedless Silicon,
硅
硅是一种基本的半导体材料，因其优异的电气性能而被广泛应用于电子工业，使集成电路和各种电子元件的制造成为可能。在产品设计和创新方面，硅是现代技术的支柱，促进了计算、电信和消费电子产品的进步。硅的多功能性还延伸到太阳能电池和传感器的应用，使其成为可持续尖端产品开发的关键要素。.
光子计算领域的最新出版物和专利
This week: photonic integrated circuit, laser module, optical waveguides, frequency comb, wavelength-multiplexing, photonic computing, neural networks, deep learning, optical network
有关渗透的最新出版物和专利
This week: photovoltaic, desalination, carbon emissions, battery storage, photoelectric conversion, avalanche diode, dark current suppression, lidar, Kluyveromyces marxianus, microbial agent,