液态金属脆化(LME)是一种比腐蚀开裂更为复杂的现象,某些韧性金属在暴露于特定液态金属时会变脆,从而导致在应力作用下突然发生灾难性的破坏。发生这种现象的原因是液态金属沿着固态金属的晶界快速渗透,从而削弱了原子间的结合力,促进了裂纹的产生和扩展。LME 在很大程度上取决于所涉及的固态金属和液态金属的组合,以及温度和外加应力等因素。常见的工业实例包括热镀锌过程中液态锌或铝对钢的脆化。
这是我们最新精选的有关液态金属脆化(LME)的全球出版物和专利,这些出版物和专利来自众多科学在线期刊,已分类并集中于液态金属脆化、金属脆化、液态金属、镓-铝、液态金属诱导脆化、诱导脆化、延展性损失、延性-脆化、晶界、汞脆化、镓脆化、铝-镓、液态镓和铝-镓。
出版物: 没有关于此特定主题的最新消息。请尝试在上面链接的出版物数据库中进行广泛的人工搜索。
Process method for producing x80 pipeline steel having extreme specifications in high water temperature seasons
Patent published on the 2025-04-03 in WO under Ref WO2025066736 by BENGANG STEEL PLATES CO LTD [CN] (Wu Gang [cn], Liu Zhipu [cn], Han Yu [cn], Gong Zhen [cn], Zhou Yanfeng [cn], Ma Siyuan [cn])
Abstract: A process method for producing X80 pipeline steel having extreme specifications in high water temperature seasons. Ideal mechanical properties and microstructure are obtained by means of controlling composition, heating, rolling, cooling, laminar cooling water temperature and other processes and technologies. The metallographic structure of the steel is composed of acicular ferrite + granular bainite + M-A; in particular, the content of the M-A component is controlled to be 4-8%, and the average[...]
Our summary: Ideal process method for producing X80 pipeline steel with extreme specifications in high water temperature seasons, achieving ideal mechanical properties and microstructure, meeting standard requirements for pipeline projects prone to large plastic deformation.
pipeline steel, process method, high water temperature, mechanical properties
Patent
Conductive and adhesive liquid metal copper paste
Patent published on the 2025-03-06 in WO under Ref WO2025049954 by VIRGINIA TECH INTELLECTUAL PROPERTIES INC [US] (Bartlett Michael D [us], Anand Tutika Ravi Tej [us])
Abstract: Embodiments of a liquid metal paste for coupling conductive components of circuits formed in or on rigid, flexible, and stretchable substrates are described. In one example, a liquid metal paste includes liquid metal. The liquid metal paste further includes copper elements mixed with the liquid metal to form a conductive mixture. In another example, the liquid metal paste further includes an elastomer material mixed with the liquid metal to form a conductive and adhesive mixture.[...]
Our summary: Liquid metal copper paste for coupling conductive components in circuits on various substrates, includes copper elements and elastomer material for conductivity and adhesion.
liquid metal, copper paste, conductive components, elastomer material
Patent
Assembly of flexible interconnects using sedimentation
Patent published on the 2025-03-06 in WO under Ref WO2025048947 by VIRGINIA TECH INTELLECTUAL PROPERTIES INC [US] (Bartlett Michael D [us], Ho Dong Hae [us])
Abstract: Embodiments of interplanar interconnects, intraplanar interconnects, and methods for forming the same in rigid, flexible, and stretchable substrates are described. In one example, a method for forming interplanar interconnects in a substrate includes injecting a solution into a mold cavity of a molding structure. The solution includes a polymer matrix and liquid metal elements. The method further includes performing a curing process on the solution to form an interplanar interconnect in the poly[...]
Our summary: Assembly of flexible interconnects using sedimentation, methods for forming interplanar and intraplanar interconnects in rigid, flexible, and stretchable substrates, injecting solution with polymer matrix and liquid metal elements into mold cavity for interplanar interconnect formation.
interconnects, sedimentation, flexible, substrates
Patent
it would be great if these patents were more accessible to students and independent researchers
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