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Cyient DLM Limited
India
Box Build & System Integration: Full product assembly and final packaging
Cables & Wire Harnesses: Custom looms and high-flex industrial cabling
CNC Machining: Precision milling, turning, and multi-axis machining
Contract Electronics Manufacturing (EMS): Full-service electronics design, assembly, and box build
PCB Assembly (PCBA): SMT and Through-hole electronics assembly

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<p><b>Cyient DLM Limited</b> is an integrated design-led manufacturing (DLM) and electronics manufacturing services provider headquartered in Hyderabad, Telangana. Founded in 1993 as an electronics manufacturing specialist and operating as a publicly traded subsidiary of Cyient Limited, the company operates manufacturing plants in Hyderabad, Bengaluru, and Mysuru covering over 450,000 square feet.</p><p>Cyient DLM focuses on low-volume, high-mix (LVHM) mission-critical electronics for safety-critical environments. It was among the first companies in India to achieve NADCAP certification for Circuit Card Assembly (CCA).</p><ul><li>Accreditations: AS9100, ISO 9001, ISO 13485, NADCAP for Electronics and Cable & Harness Assemblies</li><li>Standards: Governed by J-STD-001, IPC-A-610 Class II/III, and IPC-WHMA-A-620</li></ul>

Offer

<p>Cyient DLM offers design-led manufacturing services across board assembly, wiring systems, and complete mechanical integration:</p><ul><li><b>Printed Circuit Board Assembly (PCBA):</b> Complex rigid, flex, and rigid-flex board assembly supporting SMT and Plated Through-Hole (PTH) technologies.</li><li><b>Soldering Processes:</b> Convection reflow, vapor phase reflow, automated wave soldering, and selective soldering.</li><li><b>Component Handling:</b> High-density BGAs, micro-BGAs, QFNs, leadless chip carriers, press-fit connector installation, mixed metallurgy for BGAs, and BGA underfill.</li><li><b>Specialized Operations:</b> Automated conformal coating, bonding, potting, encapsulation, inline cleaning, and gold removal (de-golding).</li><li><b>Inspection & Validation:</b> Automated Optical Inspection (AOI), Solder Paste Inspection (SPI), X-ray inspection for void and hidden solder defect analysis, In-Circuit Testing (ICT), and customized functional testing.</li><li><b>System Integration:</b> Mechanical manufacturing, precision CNC machining, custom cable & harness assemblies, and full box-build module integration.</li></ul>

Tags

box build
pcba
ems
smt
nadcap
cable harness
plated through-hole
Industrial Specializations: Box Build & System Integration: Full product assembly and final packaging, Cables & Wire Harnesses: Custom looms and high-flex industrial cabling, CNC Machining: Precision milling, turning, and multi-axis machining, Contract Electronics Manufacturing (EMS): Full-service electronics design, assembly, and box build, and PCB Assembly (PCBA): SMT and Through-hole electronics assembly
Headquarter/main address: Plot No. 5G, Survey No. 99/1, Mamidipalli Village, GMR Aerospace & Industrial Park, GMR Hyderabad Aviation SEZ Limited, Rajiv Gandhi International Airport, Shamshabad
Hyderabad
Telangana 500108
India
Get Directions
https://www.cyientdlm.com
Business Type: Manufacturer
Ownership: Public
Turnover: €50M - €250M
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